Multi-Zone Wafer Chuck Temperature Control for Device Testing
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Solution Overview
Problem
Current temperature control systems for semiconductor processing and testing face challenges in precisely managing temperature distributions across multiple zones, especially when dealing with variations in plasma generation or film formation conditions, which can lead to uneven heating and cooling of devices under test.
Innovation Solution
A test apparatus with a wafer chuck that incorporates a mounting unit with multiple zones, each equipped with heaters and a cooling system, allowing for independent temperature control of each zone through a refrigerant circulation system and zone-specific temperature sensors, enabling precise temperature adjustments to match target temperatures for accurate device testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a two zone temperature control system with two independent coolant flow zones is used, then temperature distribution control is improved, but device complexity increases
Solution Approach 1:
The mounting unit is divided into multiple temperature control zones (first temperature control zone and second temperature control zone), each with independent temperature control capability through separate heaters and coolant flow paths, enabling independent temperature management for different device regions
Solution Approach 2:
Each temperature control zone is equipped with zone-specific temperature sensors and heaters that can independently adjust temperature according to local requirements, allowing different regions to maintain optimal temperatures tailored to specific device testing needs
2Measurement precision
If zone-specific temperature sensors and heaters are provided for each temperature control zone, then temperature measurement precision is improved, but device complexity increases
Solution Approach 1:
Temperature sensors are strategically positioned within each temperature control zone to directly measure local temperature conditions, providing zone-specific temperature data that enables precise localized temperature control without requiring complex global control algorithms
3Manufacturing precision
If refrigerant circulation system with multiple inlets and outlets is used for each zone, then temperature control precision is improved, but device complexity increases
Solution Approach 1:
The refrigerant circulation system is segmented into multiple independent coolant flow paths, with separate inlets and outlets for each temperature control zone, allowing independent temperature regulation of each zone through controlled refrigerant flow distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise temperature control across multiple zones, ensuring that devices under test are maintained at designated temperatures, improving the accuracy and reliability of operation tests by minimizing temperature variations and optimizing heating and cooling processes.
Implementation Method 1
heating by the heating mechanism 40
Implementation Method 2
cooling by the cooling mechanism 50
Data Source
AI summary
Provided is a temperature control apparatus, comprising: a mounting unit including a mounting surface for mounting a board-shaped test object on which a plurality of devices are formed; a plurality of heaters provided for each of a plurality of zones into which the mounting surface is divided, which heats corresponding one of the plurality of zones; a device temperature acquiring unit which acquires device temperature data according to a temperature measurement value in a device under test connected to a probe for an operation test among the plurality of devices of the test object; and a temperature control unit which controls two or more of the heaters corresponding to two or more of the zones on each of which at least part of the device under test is mounted, thereby closing a gap between a temperature indicated by the device temperature data and a first target temperature.