Wafer Chuck Temperature Control via Dynamic Sensor Selection
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Solution Overview
Problem
Current temperature control methods for wafers in the semiconductor industry are expensive and inefficient, as they continuously regulate areas of the chuck or wafer that are not significant for functional tests, leading to unnecessary heating and cooling.
Innovation Solution
A method that detects the position of a test means and selects the temperature-measuring means with the smallest spatial distance or greatest temperature change as a reference to uniformly control the temperature of the chuck, reducing unnecessary heating and cooling of insignificant areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If continuous temperature control is applied to all areas of the chuck, then temperature uniformity is improved, but energy consumption and cost increase
Solution Approach 1:
The patent applies local quality by differentiating temperature control between different areas of the chuck. The control method identifies which areas are relevant for functional tests and applies temperature control only to those areas, while leaving other areas uncontrolled. This resolves the contradiction by maintaining temperature uniformity where needed (improving stability) while avoiding energy waste in irrelevant areas (reducing energy consumption).
Solution Approach 2:
The patent segments the chuck into multiple temperature zones based on their relevance to functional testing. By dividing the chuck into controlled and uncontrolled areas, the system can apply temperature regulation selectively. This segmentation allows the system to maintain temperature uniformity in test-relevant zones while eliminating unnecessary energy consumption in other zones.
2Measurement precision
If multiple temperature sensors and control elements are used for area-specific temperature control, then temperature precision is improved, but device complexity increases
Solution Approach 1:
The patent applies dynamics by making the selection of reference temperature-measuring means dynamic rather than static. The system continuously detects the position of the test means and dynamically selects the most appropriate reference temperature sensor based on current spatial relationships. This dynamic approach maintains temperature measurement precision without requiring complex static control systems for every possible position, thereby reducing overall device complexity.
Solution Approach 2:
The patent applies partial action by using only the necessary subset of temperature sensors and control elements at any given time. Instead of activating all temperature control elements simultaneously, the system selectively engages only those needed for the current test position. This reduces the effective complexity of the control system while maintaining the precision needed for accurate temperature control.
3Stability of the object's composition
If all areas of the chuck are continuously temperature-controlled, then temperature stability is improved, but productivity decreases due to unnecessary heating and cooling
Solution Approach 1:
The patent applies local quality by restricting temperature control to only those areas of the chuck that are relevant for functional testing. By identifying and controlling only the necessary zones, the system maintains temperature stability where it matters for test accuracy while eliminating wasteful heating and cooling in irrelevant areas, thereby improving overall testing efficiency and productivity.
Solution Approach 2:
The patent extracts the temperature control function from the entire chuck and applies it only to the relevant areas. By taking out the unnecessary temperature control operations from irrelevant areas, the system maintains temperature stability in test-critical zones while removing the productivity-reducing waste of heating and cooling areas that do not affect test results.
Data Source
AI summary
A method for open-loop or closed-loop control of the temperature of a chuck for a wafer includes detecting the position of a test device for testing a wafer and determining the spatial distances between the test device and a plurality of temperature measurement devices for measuring the temperature of the chuck or of a wafer supported or clamped by the chuck. The method proceeds by selecting at least one temperature measurement device from the plurality of temperature measurement devices as a reference temperature measurement device; and controlling the temperature of the chuck by open-loop or closed-loop control on the basis of the temperature(s) of the chuck or wafer as measured by the selected one or more reference temperature measurement devices.