Wafer Clamp Mechanism for Flat Substrate Inspection
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Solution Overview
Problem
Existing substrate inspection devices face issues with substrate flatness and detection sensitivity due to variations in wafer radius, leading to deformation and reduced reliability in foreign matter inspection.
Innovation Solution
A substrate inspection device with a clamp mechanism that moves in the in-plane direction to hold the substrate and an air pressure correction structure to stabilize the substrate, ensuring flatness and stability during inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a vertically rotating pressing portion is used to hold the wafer, then the wafer can be held securely, but when the wafer radius differs from the specified value, the wafer abutting surface becomes inclined and causes wafer deformation
Solution Approach 1:
The pressing portion is changed from a vertically rotating structure to a structure that moves horizontally in the in-plane direction of the substrate. This dynamic adjustment allows the pressing portion to maintain optimal contact with the substrate regardless of radius variations, preventing inclination and deformation while still providing secure holding.
Solution Approach 2:
The movement direction of the pressing portion is changed from vertical rotation to horizontal in-plane movement. This parameter change in the pressing mechanism allows adaptation to different substrate radii without creating inclination angles, thereby maintaining wafer flatness while ensuring secure holding.
2Adaptability or versatility
If the wafer abutting surface is inclined due to radius variation, then the clamp mechanism can adapt to different sizes, but wafer deformation occurs reducing inspection reliability
Solution Approach 1:
The pressing portion moves horizontally to dynamically adjust its position and maintain proper contact orientation with substrates of varying radii. This dynamic movement ensures adaptation to different sizes without creating the inclination that would compromise inspection reliability.
Solution Approach 2:
The vertical rotation mechanism is replaced with a horizontal movement mechanism. This substitution eliminates the generation of inclination angles while maintaining the ability to hold different substrate sizes, thereby preserving inspection reliability across varying radii.
3Device complexity
If a fixed pressing portion is used, then the structure is simple, but it cannot accommodate wafer radius variations without causing deformation
Solution Approach 1:
The pressing portion is made movable in the in-plane direction rather than being fixed. This dynamic capability allows the simple structure to adapt to different wafer radii, maintaining wafer flatness without requiring complex adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances substrate flatness and improves detection sensitivity for foreign matters by stabilizing the substrate during inspection, reducing deformation and maintaining high reliability.
Implementation Method 1
a mechanism that corrects self-weight sinking of the wafer by blowing air from a center of a turntable to a back surface of the wafer
Data Source
AI summary
The purpose of the present invention is to provide a substrate inspection device that increases the flatness of a substrate during inspection, and improves the detection sensitivity of foreign matter. Therefore, the present invention is a substrate inspection device provided with a turntable on which a substrate to be inspected is mounted, and a clamp mechanism that holds the substrate on the turntable. The substrate inspection device is characterized in that the clamp mechanism has an abutting part that moves in an in-plane direction of the substrate and presses the substrate. Preferably, the abutting part contacts or separates from an outer peripheral side surface of the substrate by rotating centered on a rotational axis in an out-of-plane direction of the substrate.