Wafer Clamp Assembly With Quick-Release Liquid-Draining Structure
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Solution Overview
Problem
Existing clamp assemblies in electroplating and cleaning processes for wafers suffer from residual liquid contamination and difficulty in assembling and disassembling, leading to inefficient workflows.
Innovation Solution
A clamp assembly design featuring a base, clamping element, and limiting element with angled guide and limiting holes, allowing for quick assembly and disassembly, and preventing residual liquid accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the linking ring is rotated by the actuating rod to lock and fix the upper cap, then the wafer positioning is stable, but the clamp assembly becomes difficult to disassemble and assemble
Solution Approach 1:
The clamp assembly is divided into separable components: the electroplating carrier (base) and the upper cap (clamping element) that can be easily detached from each other, while maintaining stable wafer positioning when assembled
Solution Approach 2:
The actuating rod mechanism is extracted and simplified to merely integrate the limiting element into the guide hole, allowing the clamping element to be easily removed and reattached without complex rotation operations
2Reliability
If the linking ring, electroplating carrier, upper cap and actuating rod are used in the electroplating process, then the wafer can be clamped securely, but residual liquid contamination occurs
Solution Approach 1:
The clamp assembly is segmented into separable parts (base and clamping element) that can be easily detached for cleaning, preventing residual liquid accumulation and contamination
Solution Approach 2:
The complex linking ring and actuating rod structures are removed, replacing them with a simple limiting element that integrates into the guide hole, eliminating crevices where liquid could accumulate
Data Source
AI summary
A clamp assembly includes at least one clamp which is provided to clamp a workpiece in electroless plating, etching, electroplating or cleaning process. The clamp includes a base, a clamping element and a limiting element. The base is mounted on a carrier and includes a guide hole and a first limiting hole which are communicated with each other. The clamping element includes a guide rod and a second limiting hole, the guide rod is inserted into the guide hole to allow the second limiting hole located on the guide hole to be communicated with the first limiting hole. The limiting element is inserted into the first and second limiting holes to integrate the base with the clamping element for clamping the workpiece.