Wafer Clamp Sensor Feedback for Precision Handling
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Solution Overview
Problem
Conventional robotic forks for picking and placing wafers face issues with misalignment, inability to precisely position wafers, and are not adaptable to sensitive components like optical components, and are limited in fast movement and rotation without flipping over the wafer.
Innovation Solution
A wafer clamp system comprising a platform, stopper, push rod, actuator, and sensor that allows precise positioning and holding of wafers without physical contact, using a pneumatic cylinder actuator and fiber optic sensor for distance measurement and actuation, enabling precise and secure handling of wafers during movement and rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional vacuum fork is used to hold a wafer, then the wafer can be picked and placed automatically, but misalignment occurs and the wafer cannot be precisely positioned, causing falling and breaking
Solution Approach 1:
The patent replaces the conventional mechanical vacuum fork system with a sensor-based detection system. A sensor (optical, capacitive, or inductive) detects the wafer's position and provides feedback to a controller, which adjusts the fork's position to achieve precise alignment. This substitution of mechanical alignment with sensor-based feedback control resolves the positioning precision issue while maintaining reliability.
Solution Approach 2:
The patent implements a feedback control system where a sensor continuously monitors the wafer's position relative to the fork, and the controller adjusts the fork's position based on this feedback. This closed-loop control ensures precise positioning and prevents misalignment, thereby improving both positioning precision and handling reliability.
2Adaptability or versatility
If a conventional vacuum fork makes physical contact with the wafer surface, then the wafer can be held, but it is not adaptable to sensitive components like optical components
Solution Approach 1:
The patent replaces direct mechanical contact with a sensor-based detection system. The sensor detects the wafer's presence and position without physical contact, allowing the system to adapt to different wafer types including sensitive optical components. This eliminates the harmful mechanical contact while maintaining the ability to hold and manipulate wafers.
Solution Approach 2:
The patent introduces a sensor as an intermediary between the fork and the wafer. The sensor mediates the interaction by detecting the wafer's position and providing feedback, enabling the system to handle sensitive components without direct mechanical contact, thus improving adaptability while preventing damage.
3Speed
If an engaged type fork is used to overcome vacuum fork disadvantages, then the wafer can be held more securely, but the fork is incapable of fast moving or rotating without flipping over the wafer
Solution Approach 1:
The patent employs a dynamically adjustable fork mechanism that can change its engagement depth and position based on real-time feedback from sensors. During fast movement or rotation, the fork adjusts its position to maintain optimal engagement, preventing the wafer from flipping over while enabling high-speed operation. This dynamic adjustment resolves the contradiction between speed and orientation stability.
Solution Approach 2:
The patent uses sensor feedback to continuously monitor the wafer's position and orientation during movement. The controller adjusts the fork's engagement in real-time based on this feedback, ensuring that the wafer remains stable during fast movement and rotation. This feedback control enables high-speed operation while maintaining orientation stability.
4Extent of automation
If conventional robotic forks are used for picking and placing wafers, then automation is achieved, but they cannot effectively position and pick the wafer due to misalignment
Solution Approach 1:
The patent enhances automated wafer handling by incorporating sensor-based feedback control. The sensor detects the wafer's position and provides feedback to the controller, which automatically adjusts the fork's position to achieve precise alignment. This feedback mechanism maintains full automation while dramatically improving positioning precision.
Solution Approach 2:
The patent replaces mechanical alignment methods with sensor-based detection and feedback control. The sensor system automatically detects the wafer's position and guides the fork's positioning, eliminating misalignment issues while maintaining automation. This substitution enables both high automation and high positioning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise positioning and secure handling of wafers, allowing fast movement and rotation without flipping, improving the reliability of wafer handling and adaptability to sensitive components like optical components.
Implementation Method 1
A sensor is disposed at the front end of the platform to measure a distance between the sensor and a wafer over the sensor
Implementation Method 2
at least one actuator is actuated to move a push rod forward such that the wafer is held tightly between a stopper and the push rod
Data Source
AI summary
A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.