Single-Wafer Wet Clean Baffle Structure for Etchant Splash Control
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Solution Overview
Problem
Existing wet clean apparatuses for single wafers suffer from etchant splashes due to high-speed etchant collisions with baffles, leading to defects on the wafer surface and reduced product yield.
Innovation Solution
The apparatus incorporates a baffle with an anti-splash structure that includes a first vertical plate with a transverse opening aligned with the etchant's movement track, a second transverse plate for initial deceleration, and optional inclined and arc plates for further deceleration, ensuring the etchant flows back for recovery without splashing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a vertical plate baffle is used to block and recycle etchant, then etchant recovery is improved, but etchant splash occurs due to high-speed collision
Solution Approach 1:
The baffle is segmented into multiple functional parts: a vertical plate for initial blocking, an inclined plate for deceleration, and a curved plate for flow redirection. This segmentation allows the etchant to be gradually decelerated and guided through controlled paths, preventing splash while maintaining recovery efficiency.
Solution Approach 2:
The inclined plate and curved plate act as intermediary structures between the high-speed etchant flow and the vertical plate. These intermediaries gradually reduce the etchant's kinetic energy through controlled deceleration, preventing direct high-speed collision with the vertical plate that would cause splash.
2Loss of substance
If the baffle is positioned close to the wafer for effective blocking, then etchant recovery efficiency is improved, but splash risk increases due to collision speed
Solution Approach 1:
The inclined plate is positioned upstream of the vertical plate to preliminarily decelerate the etchant before it reaches the main blocking structure. This preliminary action reduces the kinetic energy of the etchant, allowing the vertical plate to be positioned closer to the wafer for efficient recovery without causing splash.
3Device complexity
If the baffle structure is simplified to reduce complexity, then device complexity is reduced, but splash prevention capability is insufficient
Solution Approach 1:
Multiple functional elements (vertical plate, inclined plate, curved plate) are merged into a single integrated baffle structure. This merging achieves comprehensive splash prevention through coordinated action of different geometric features while maintaining relatively simple manufacturing and installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anti-splash structure effectively decelerates the etchant, preventing splashes and defects on the wafer, while the recovery structure allows for efficient etchant collection, thereby improving product yield and simplifying the apparatus design.
Implementation Method 1
the etchant passing through the first opening flows on the top surface of the second transverse plate so that the etchant undergoes a first time of deceleration
Implementation Method 2
a third inclined plate, wherein a first end of the third inclined plate is fixedly arranged on a second end of the second transverse plate; the top surface of the third inclined plate presents a slope structure
Data Source
AI summary
The present application discloses a wet clean apparatus for a single wafer, comprising: a baffle arranged on the periphery of the wafer bearing platform. The anti-splash structure comprises: a first vertical plate, wherein a length direction thereof is perpendicular to the surface of the wafer; a first opening transversely passing through the first vertical plate, wherein the first opening is arranged on a movement track of the etchant shaken off from the surface of the wafer; and a second transverse plate, wherein a first end thereof is fixedly arranged on the outer side surface of the first vertical plate, the top surface of the second transverse plate is horizontal and is lower than or flush with the bottom surface of the first opening, and the etchant passing through the first opening flows on the top surface of the second transverse plate and is decelerated.