Wafer Cleaning Brush with Swing Arm Mechanism
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Solution Overview
Problem
Traditional cleaning methods for semiconductor wafers, relying on chemical reactions, fail to meet the increasing complexity and cleanliness requirements of advanced semiconductor devices, leading to inefficiencies and potential batch failures.
Innovation Solution
A brush-based cleaning apparatus with a swing arm and rotating actuator, utilizing a brush module with a brush head that applies mechanical force across the wafer surface, combined with chemical or de-ionized water delivery, to effectively remove contaminants while controlling pressure and movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional wet cleaning or dry cleaning methods are used, then chemical reactions can remove contaminants, but cleaning effectiveness is insufficient for complex semiconductor device structures
Solution Approach 1:
The patent replaces traditional chemical cleaning methods with a mechanical brush cleaning system. The brush module applies physical mechanical force through bristles that directly contact and remove contaminants from the wafer surface, eliminating reliance on chemical reactions and enabling effective cleaning of complex three-dimensional structures.
Solution Approach 2:
The brush module is designed with dynamic movement capabilities, including rotation around a vertical axis and oscillation in horizontal and vertical directions. This multi-degree-of-freedom motion allows the brush to adapt to complex wafer surface geometries and maintain effective cleaning contact across varying topographies.
2Manufacturing precision
If mechanical brush cleaning is applied, then cleaning effectiveness improves, but control of mechanical force on wafer surface is critical to avoid damage
Solution Approach 1:
The brush module incorporates dynamic movement including rotation and oscillation that prevents excessive stationary pressure on any single point of the wafer surface. The continuous motion distributes mechanical force across different areas and time periods, reducing the risk of localized damage while maintaining effective contaminant removal.
Solution Approach 2:
The brush module performs periodic oscillation and rotation rather than continuous static contact. This periodic action allows brief intervals where mechanical force is applied for contaminant removal, followed by movement that redistributes and reduces accumulated pressure, preventing mechanical damage to sensitive wafer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cleaning effectiveness by applying controlled mechanical force, improving the removal of particles, metal, and organic contaminants, thus meeting the stringent cleaning demands of advanced semiconductor technology.
Implementation Method 1
The brush module has a brush head for providing mechanical force on a surface of a wafer
Implementation Method 2
The rotating actuator is connected with the other end of the swing arm. The rotating actuator drives the swing arm to swing across the whole surface of the wafer, which brings the brush head moving across the whole surface of the wafer
Implementation Method 3
The elevating actuator is connected with the other end of the swing arm. The elevating actuator drives the swing arm to rise or descend, which brings the brush module rising or descending
Data Source
AI summary
An apparatus and method for cleaning semiconductor wafer are provided. The apparatus includes a brush module, a swing arm, a rotating actuator and an elevating actuator. The brush module has a brush head for providing mechanical force on a surface of a wafer. An end of the swing arm mounts the brush module. The rotating actuator is connected with the other end of the swing arm. The rotating actuator drives the swing arm to swing across the whole surface of the wafer, which brings the brush head moving across the whole surface of the wafer. The elevating actuator is connected with the other end of the swing arm. The elevating actuator drives the swing arm to rise or descend, which brings the brush module rising or descending. The apparatus cleans the semi-conductor wafer by means of the brush head, which improves the cleaning effect.