Wafer Cleaning Inlet Structure for Automatic Bubble Discharge
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Solution Overview
Problem
Current wafer cleaning devices experience downtime due to unstable bubble flow from CO2 water, leading to abnormal valve operations and reduced utilization, as bubbles accumulate and require manual discharge, disrupting the machining process.
Innovation Solution
A wafer cleaning device design featuring a liquid inlet pipe with a protrusion and cavity to collect bubbles, combined with bubble thorns to decompose large bubbles and a controlled discharge system using valves and a photoelectric sensing device to manage bubble flow, ensuring stable cleaning solution spray and reduced downtime.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If CO2 water is used for cleaning, then cleaning effectiveness is improved, but bubble accumulation causes unstable flow and requires manual discharge, reducing device utilization
Solution Approach 1:
The system automatically discharges bubbles through a discharge hole in the protrusion without manual intervention. The photoelectric sensing device detects bubble presence and triggers the valve to open, allowing bubbles to be automatically removed from the cleaning solution flow, eliminating downtime and maintaining continuous operation.
Solution Approach 2:
The photoelectric sensing device continuously monitors the cleaning solution flow and detects bubble accumulation. When bubbles are detected, the system provides feedback to control the valve, which opens to discharge bubbles through the discharge hole, then closes to resume normal cleaning operation, creating a closed-loop control system.
2Reliability
If manual bubble discharge is used, then bubble removal is achieved, but device utilization is reduced due to downtime
Solution Approach 1:
The system automatically discharges bubbles through a discharge hole in the protrusion without manual intervention. The photoelectric sensing device detects bubble presence and triggers the valve to open, allowing bubbles to be automatically removed from the cleaning solution flow, eliminating downtime and maintaining continuous operation.
Solution Approach 2:
The automatic bubble discharge system allows the cleaning device to operate continuously without interruption. The protrusion structure with discharge hole enables bubbles to be removed in real-time during operation, maintaining continuous cleaning action and eliminating the downtime associated with manual bubble discharge.
3Quantity of substance
If large bubbles are present in cleaning solution, then cleaning solution can be supplied, but valve operation becomes abnormal and flow becomes unstable
Solution Approach 1:
The protrusion structure with discharge hole extracts and removes large bubbles from the cleaning solution flow. By providing a dedicated discharge path through the protrusion, large bubbles are separated from the main flow before reaching the valve, preventing abnormal valve operation and maintaining stable flow control.
Solution Approach 2:
The protrusion acts as an intermediary element between the cleaning solution supply and the valve. It intercepts large bubbles and provides a discharge hole for their removal, serving as a mediator that protects the valve from direct contact with large bubbles, thereby maintaining stable valve operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes the cleaning solution flow, improves etching rates, reduces device alarms, and extends operational time by automatically managing bubble discharge, enhancing the yield and efficiency of the wafer cleaning process.
Implementation Method 1
a photoelectric sensing device, arranged on the liquid inlet pipe and located between the protrusion and the first valve, to detect bubbles in a cleaning solution flow
Implementation Method 2
a protrusion, formed by protruding a wall of the liquid inlet pipe outward, with a cavity communicated with inside of the liquid inlet pipe... to collect and decompose large bubbles
Data Source
AI summary
The present disclosure relates to the technical field of wafer cleaning, and in particular to a wafer cleaning device and a wafer cleaning system. The wafer cleaning device includes a liquid inlet pipe, a first liquid discharge pipe, a first valve and a liquid supply device, wherein the liquid inlet pipe has an inlet terminal and an outlet terminal; a wall of the liquid inlet pipe is protruded outward to form a protrusion, the protrusion having a cavity; one terminal of the first liquid discharge pipe is communicated with the cavity, while the other terminal thereof is communicated with a container; the first valve is arranged on the liquid inlet pipe and located between the protrusion and the outlet terminal; and, the liquid supply device is communicated with the inlet terminal of the liquid inlet pipe to import cleaning solution into the liquid inlet pipe.