Rotating Multi-Nozzle Wafer Cleaning to Minimize Edge Scattering
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Solution Overview
Problem
The scattering of cleaning solution during substrate treatment due to a mismatch between the linear velocity of the substrate and the discharge velocity of the cleaning solution, particularly at the edge, leads to nozzle contamination and substrate faults.
Innovation Solution
A substrate treating apparatus with a cleaning solution supply unit that includes nozzles of varying outlet sizes and a controller to adjust the discharge head's movement, rotation, and angle, ensuring the cleaning solution is discharged at velocities matching the substrate's linear velocity across its surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single nozzle discharges cleaning solution at a set velocity, then the discharge mechanism is simple, but liquid scattering occurs at the substrate edge where linear velocity differs significantly
Solution Approach 1:
The single nozzle is divided into multiple nozzles arranged in an array. Each nozzle is positioned to discharge cleaning solution at different locations across the substrate surface, allowing velocity matching at multiple points simultaneously. This segmentation resolves the contradiction by maintaining simple individual nozzle structures while achieving reliable cleaning across the entire substrate including the edge region.
Solution Approach 2:
Different nozzles in the array are configured with specific discharge velocities tailored to match the local linear velocity of the substrate at their respective positions. Nozzles positioned at the substrate edge discharge at higher velocities to match the higher linear velocity in that region, while central nozzles discharge at lower velocities. This local customization of discharge parameters eliminates scattering while maintaining overall system simplicity.
2Reliability
If the cleaning solution discharge velocity is increased to match the high linear velocity at the substrate edge, then scattering at the edge is reduced, but scattering occurs at the center region where linear velocity is lower
Solution Approach 1:
The cleaning solution delivery system is segmented into multiple independent nozzles, each capable of operating at different discharge velocities. This allows the edge nozzles to discharge at high velocity to match the high linear velocity at the substrate edge, while central nozzles discharge at lower velocities appropriate for the lower linear velocity in the center region, eliminating scattering at both locations simultaneously.
Solution Approach 2:
Each nozzle in the array is configured with local quality parameters (discharge velocity, angle, position) optimized for its specific location on the substrate. Edge nozzles have higher discharge velocities matched to the higher linear velocity at the substrate edge, while central nozzles have lower discharge velocities matched to the lower linear velocity in the center, preventing harmful scattering effects at any location.
3Device complexity
If the nozzle remains stationary while the substrate rotates, then the discharge mechanism is simple, but the velocity mismatch causes nozzle contamination and substrate faults
Solution Approach 1:
The stationary nozzle is segmented into multiple nozzles arranged in an array that spans across the substrate surface. This array configuration allows each nozzle to target a specific region of the rotating substrate, maintaining simple stationary discharge mechanisms while achieving reliable treatment across the entire substrate surface through the distributed nozzle arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Minimizes liquid scattering by aligning discharge velocities with substrate linear velocities, preventing nozzle contamination and enhancing substrate treatment efficiency.
Implementation Method 1
minimizing liquid scattering by minimizing a difference between a linear velocity of a substrate and a liquid discharge velocity when discharging a liquid onto a substrate having a different linear velocity from a center to an edge
Implementation Method 2
rotates the rotating unit such that, upon movement of the discharge head, nozzles having smaller inner diameters of the outlet are placed from the center region of the substrate to the edge region
Data Source
AI summary
Disclosed is a substrate treating apparatus for treating a substrate, the substrate treating apparatus including: a cup for providing a treatment space; a support unit provided to support a substrate in the treatment space; a cleaning solution supply unit for supplying a cleaning solution to the substrate supported on the support unit; and a controller for controlling the support unit and the cleaning solution supply unit, in which the cleaning solution supply unit includes: a support arm; a discharge head provided with a plurality of nozzles having outlets of different sizes; a rotating unit for rotating the discharge head; and a moving unit for moving the discharge head between a center region of the substrate and an edge region of the substrate, and the controller causes the cleaning solution to be discharged while moving the discharge head between a center region of the substrate and an edge region of the substrate, and rotates the rotating unit such that, upon movement of the discharge head, nozzles having smaller inner diameters of the outlet are placed from the center region of the substrate to the edge region.