Wafer Cleaning Sequence With Die Gap Widening and Spray Drying
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Solution Overview
Problem
Current wafer processing methods are inefficient in reducing processing time and improving cleaning performance, particularly in widening gaps between dies to effectively remove foreign materials.
Innovation Solution
A wafer processing method involving a chuck table with a moving module to widen gaps between dies, using a spray arm module to apply processing solutions, including pure water and a mixture of water and nitrogen, and rotating the chuck table for drying, which enhances cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional wafer processing method is used, then the processing procedure is simple, but the processing time is long and cleaning performance is insufficient
Solution Approach 1:
The patent divides the wafer processing into multiple sequential stages: mounting, loading, first spraying (pure water), second spraying (water-nitrogen mixture), and drying. Each stage performs a specific function, allowing comprehensive processing while maintaining organized complexity. The segmentation enables parallel optimization of each step to reduce total processing time.
Solution Approach 2:
The chuck table is designed with a moving module that can dynamically adjust the gaps between dies during processing. The spray arm module can move to different positions and spray at different angles. These dynamic adjustments allow the system to adapt to different processing requirements and improve efficiency without permanent structural complexity.
2Object-affected harmful factors
If the gaps between dies are not widened, then the processing structure is simple, but foreign materials cannot be effectively removed
Solution Approach 1:
The chuck table incorporates a moving module that dynamically adjusts the spacing between dies during the processing cycle. This dynamic gap widening creates channels that allow spray solutions to reach and remove foreign materials from between dies, while returning to the original configuration afterward. This resolves the contradiction by providing temporary structural change only when needed.
Solution Approach 2:
The patent extracts the gap adjustment function as a separate moving module within the chuck table system. This modular approach allows the gap widening capability to be added without fundamentally redesigning the entire chuck table structure, maintaining relative simplicity while achieving effective foreign material removal.
3Object-affected harmful factors
If multiple processing solutions are sprayed sequentially, then cleaning performance is improved, but processing time increases
Solution Approach 1:
The patent implements continuous processing by eliminating idle time between spraying stages. The first spray (pure water) and second spray (water-nitrogen mixture) are performed in sequential succession without interruption, with the spray arm module continuously positioned over the wafer. The drying phase immediately follows, maintaining continuous useful action throughout the cleaning process.
Solution Approach 2:
The processing uses periodic alternation between different spray solutions - first pure water, then a water-nitrogen mixture - with each solution serving a specific cleaning purpose. This periodic application of different cleaning mechanisms improves overall cleaning performance while the rapid transition between stages minimizes time loss.
4Area of stationary object
If the spray arm module swings within a large angle range, then processing coverage is improved, but processing time increases
Solution Approach 1:
The spray arm module employs dynamic angular movement, swinging through optimized angle ranges that provide sufficient coverage of the wafer surface and gaps between dies. The angular range is calibrated to cover all necessary areas without excessive movement, balancing coverage requirements with time efficiency.
Solution Approach 2:
The spray system applies different spray solutions with different properties to different areas and stages of the process - pure water for initial cleaning and water-nitrogen mixture for final cleaning and drying preparation. This local differentiation of spray quality and timing optimizes both coverage and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces processing and cleaning time while improving cleaning performance by effectively removing foreign materials from the wafer surfaces and gaps, thereby reducing defect rates.
Implementation Method 1
moving, by a moving module, a vacuum chuck unit of the chuck table and pulling the wafer part in a radial direction thereof to widen gaps between dies of the wafer part
Implementation Method 2
spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part
Implementation Method 3
rotating the chuck table to dry the wafer part
Data Source
AI summary
A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading the wafer part on the chuck table, spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part, spraying, by the spray arm module, a second processing solution onto the wafer part to process the wafer part, drying the wafer part on the chuck table, and unloading the wafer part from the chuck table.