Wafer Cleaning Nozzle Path Visibility Using Laser Marking

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Solution Overview

Problem

Existing cleaning devices for wafers struggle to allow operators to visually monitor the cleaning process effectively due to the use of transparent cleaning solutions, making it difficult to ensure the wafer is cleaned according to a predetermined path.

Innovation Solution

A cleaning device equipped with a laser marking unit that projects laser lights onto the cleaning solution sprayed on the wafer, combined with a movable nozzle system and an image-capture unit to facilitate on-site inspection and generate sequential pictures of the cleaning process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a transparent cleaning solution is used to clean the wafer, then the cleaning effectiveness is maintained, but it becomes difficult for operators to visually monitor the cleaning process and verify the predetermined cleaning path

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidvisual monitoring capability
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent applies laser light projection to create visible markings on the transparent cleaning solution, transforming it into a visually detectable state. The laser marks the cleaning solution along the predetermined cleaning path, enabling operators to observe and verify the cleaning process while maintaining the use of transparent cleaning solution for effective cleaning

Inventive Principle:
Principle #32Color changes

2Loss of information

If operators need to visually monitor the cleaning path, then verification capability is improved, but the transparency of the cleaning solution prevents effective observation

Engineering Contradiction:
Improvecleaning path verificationVSAvoidcleaning solution transparency
Core Design Contradiction:
Loss of informationVSQuantity of substance

Solution Approach 1:

The laser marking unit serves as an intermediary between the transparent cleaning solution and the operator's visual observation. It projects laser light onto the cleaning solution to create visible markings, acting as a mediator that enables observation without changing the cleaning solution's transparency or cleaning effectiveness

Inventive Principle:
Principle #24Intermediary (Mediator)

3Difficulty of detecting and measuring

If the cleaning solution is made visible for monitoring, then observation capability is improved, but the original transparent nature of the cleaning solution is compromised

Engineering Contradiction:
Improvecleaning process visibilityVSAvoidcleaning solution performance
Core Design Contradiction:
Difficulty of detecting and measuringVSReliability

Solution Approach 1:

The patent separates the visibility function from the cleaning function. The laser marking unit provides visibility by projecting light onto the cleaning solution, while the cleaning solution itself maintains its transparent and effective cleaning properties. This segmentation allows both visibility and cleaning effectiveness to coexist without compromising either

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective on-site inspection of the cleaning process and ensures thorough cleaning by allowing operators to monitor the cleaning path and verify completion, enhancing the precision and reliability of wafer cleaning.

Implementation Method 1

The laser marking unit is connected to the left-right mount and is adapted to project laser lights to the cleaning solution sprayed on the wafer

Methodology Applied
Scientific EffectLight: Light

Data Source

PatentUS20260090313A1Cleaning device including laser marking unit
Publication Date: 2026.03.26 MU-TECH PRECISION CO LTD
  • US20260090313A1 patent drawing
  • US20260090313A1 patent drawing
  • US20260090313A1 patent drawing

AI summary

A cleaning device includes a base unit adapted to support a wafer and a drive unit disposed above the base unit. The drive unit includes a left-right mount, a left-right slide seat slidably disposed on the left-right mount, a top-bottom mount fixed to the left-right slide seat, a top-bottom slide seat slidably disposed on the top-bottom mount, and a carry plate fixed to the top-bottom slide seat. A nozzle seat is connected to the carry plate. A nozzle is connected to the nozzle seat to spray a cleaning solution onto the wafer. A laser marking unit is connected to the left-right mount to project laser lights to the cleaning solution sprayed onto the wafer.