Semiconductor Wafer Cleaning Micro Chamber Alignment
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Solution Overview
Problem
Existing semiconductor wafer cleaning apparatus designs face limitations such as restricted three-dimensional movement, deformation issues with larger chamber dimensions, precise machining requirements for alignment, and particle contamination due to moving parts, which hinder effective processing and increase manufacturing complexity.
Innovation Solution
The design incorporates a semiconductor wafer cleaning apparatus with a micro processing chamber formed by interlocking supporting units and spacing posts, featuring adjustable supporting bars and screws for enhanced stability and alignment, along with air bags or pneumatic positioners for precise movement, and a leakage detection system to minimize contamination and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If posts are used to hold upper and lower movable parts together, then the structure is simple and easy to manufacture, but the three-dimensional movement of the micro processing chamber is limited
Solution Approach 1:
The patent removes the posts that were holding the upper and lower movable parts together, extracting the constraint element that limited three-dimensional movement. This allows the micro processing chamber to move freely in three dimensions while the plates are held together by alternative means during operation.
Solution Approach 2:
The patent implements dynamic positioning where the upper and lower movable parts can move relative to each other in three dimensions during operation. The system transitions from a static post-held structure to a dynamic system where plates are held together during processing but allow chamber movement when operational.
2Volume of moving object
If the chamber dimension is increased, then the processing capacity is improved, but the plates holding the chambers together deform easily
Solution Approach 1:
The patent divides the chamber structure into an upper movable part and a lower movable part that can operate independently. This segmentation allows each part to be optimized for its specific function and reduces the stress on individual plates, preventing deformation even as overall chamber dimensions increase.
Solution Approach 2:
The system allows the upper and lower chambers to move dynamically during operation rather than being rigidly fixed. This dynamic operation reduces static stress on the plates holding the chambers together, preventing deformation while allowing larger chamber dimensions for increased processing capacity.
3Manufacturing precision
If accurate machining of posts and holes is performed, then the alignment of parts is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the posts entirely from the design, eliminating the need for accurate machining of posts and their corresponding holes. The upper and lower movable parts are held together by alternative means that do not require the same level of precision machining, thereby reducing manufacturing complexity while maintaining alignment.
4Ease of operation
If movable parts move along posts, then the chamber can be opened and closed, but particles are generated due to friction causing contamination
Solution Approach 1:
The patent removes the posts that caused friction and particle generation. The movable parts are designed to open and close the chamber without sliding along posts, eliminating the source of particle contamination while maintaining operational capability.
Solution Approach 2:
The patent replaces the mechanical sliding movement along posts with an alternative mechanism that reduces friction and particle generation. The upper and lower movable parts are positioned and held together without the need for sliding contact, substituting the friction-based mechanical system with a cleaner alternative.
Data Source
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AI summary
Embodiments of a semiconductor wafer cleaning apparatus are provided. In one aspect, a semiconductor wafer cleaning apparatus may include a first supporting unit, a movable unit having a first chamber, a second supporting unit having a second chamber, and a third supporting unit. A micro processing chamber in which the semiconductor wafer is being processed is formed when the first chamber is brought in contact with the second chamber. Each of the supporting units is supported by a corresponding supporting plate, and each supporting plate is positioned and strengthened by a plurality of supporting bars on its peripheral. Such design will prevent the deformation of the supporting plates, reduce the particles generated by the friction of parts resulted from the opening or closure of the micro processing chamber, and allow the easy alignment of these units.