Wafer Cleaning Sequence With Chemical Liquid and Organic Solvent
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Solution Overview
Problem
Conventional cleaning methods for semiconductor wafers using pure water or chemical liquids are insufficient for removing organic residues, leading to increased costs, apparatus size, and reduced throughput due to the need for additional cleaning processes and equipment.
Innovation Solution
A cleaning apparatus and method that uses a combination of chemical liquids and organic solvents in a single unit, with a rotation support section, chemical liquid supply, organic solvent supply, and cleaning nozzles to effectively remove organic residues without increasing apparatus size or process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning using pure water or chemical liquid is used, then the cleaning process is simple and apparatus size is small, but organic residues cannot be effectively removed
Solution Approach 1:
The patent combines chemical liquid cleaning and organic solvent cleaning into a single integrated cleaning apparatus. The cleaning section includes both a chemical liquid supply nozzle and an organic solvent supply nozzle that can sequentially supply different cleaning liquids to the wafer surface without requiring separate standalone cleaning apparatuses, thereby resolving the contradiction between cleaning effectiveness and apparatus size.
Solution Approach 2:
The cleaning apparatus is designed with multi-functionality to perform both chemical liquid cleaning and organic solvent cleaning using a single device. The cleaning section can switch between different cleaning liquids (pure water, chemical liquid, organic solvent) through a unified nozzle system, making the apparatus universal and eliminating the need for multiple specialized cleaning devices.
2Reliability
If a stand-alone cleaning apparatus is added for organic residue removal, then organic residues can be removed, but apparatus cost and number of processes increase
Solution Approach 1:
The patent merges the organic solvent cleaning function into the existing cleaning section of the substrate processing apparatus. The cleaning section is configured to sequentially supply chemical liquid and organic solvent to the wafer surface using integrated supply paths and nozzles, thereby removing organic residues without adding a separate stand-alone cleaning apparatus or increasing the number of cleaning processes.
3Reliability
If sequential cleaning processes are added, then cleaning thoroughness is improved, but throughput and TAT (turnaround time) are reduced
Solution Approach 1:
The patent implements continuous cleaning action by configuring the cleaning section to sequentially supply chemical liquid and organic solvent without interrupting the wafer processing flow. The supply paths are designed to enable continuous flow of different cleaning liquids through the same nozzle system, maintaining continuous useful action on the wafer surface and avoiding process interruptions that would reduce throughput.
Solution Approach 2:
The cleaning apparatus performs preliminary cleaning with chemical liquid before organic solvent cleaning in a predetermined sequence. This preliminary action removes water-soluble contaminants first, preparing the surface for subsequent organic solvent cleaning, thereby achieving thorough cleaning through pre-planned sequential actions without extending overall processing time.
4Reliability
If multiple cleaning liquids are supplied sequentially, then cleaning effectiveness is improved, but process complexity increases
Solution Approach 1:
The patent combines multiple cleaning liquid supply functions into a single integrated cleaning section. The cleaning section includes a unified nozzle system that can switch between supplying pure water, chemical liquid, and organic solvent through integrated supply paths, thereby achieving effective multi-liquid cleaning without increasing process complexity through separate supply systems for each liquid.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reliably dissolves and removes organic residues while maintaining cleaning effectiveness without adding standalone cleaning apparatuses, reducing costs and preserving throughput by integrating cleaning and drying processes within existing substrate processing systems.
Implementation Method 1
an organic solvent supply section that supplies an organic solvent to a surface of the substrate... cleans a surface of the substrate using an organic solvent from the organic solvent supply section
Implementation Method 2
a chemical liquid supply section that supplies a chemical liquid other than an organic solvent to a surface of the substrate... cleans a surface of the substrate supported by the rotation support section using a chemical liquid from the chemical liquid supply section
Implementation Method 3
a rotation support section that supports and rotates a substrate
Implementation Method 4
a non-contact cleaning nozzle that sprays fluid onto a surface of the substrate supported by the rotation support section to clean the surface
Implementation Method 5
a drying nozzle that sprays organic solvent vapor onto a surface of the substrate to dry the surface
Data Source
AI summary
A cleaning apparatus includes: a rotation support section that supports and rotates a substrate; a chemical liquid supply section that supplies a chemical liquid other than an organic solvent to a surface of the substrate; an organic solvent supply section that supplies an organic solvent to a surface of the substrate; and cleaning means that cleans a surface of the substrate supported by the rotation support section using a chemical liquid from the chemical liquid supply section, and then cleans a surface of the substrate using an organic solvent from the organic solvent supply section with the substrate being kept supported by the rotation support section.