Substrate Transfer and Cup Lift Overlap for Faster Wafer Cleaning
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Solution Overview
Problem
Existing substrate processing devices face challenges in improving throughput due to the time required for processing each substrate, which limits the efficiency of handling large numbers of substrates.
Innovation Solution
The substrate processing device incorporates multiple holders at different heights, a processor, and a controller that coordinates overlapping operations such as substrate transfer, processing liquid application, and brush cleaning to optimize processing periods, allowing for concurrent execution of these tasks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential substrate processing is used with single holder, then processing simplicity is maintained, but throughput is limited due to prolonged processing time per substrate
Solution Approach 1:
The patent introduces a vertical dimension by positioning substrate holders at different height levels (first holder at higher position, second holder at lower position). This allows overlapping of substrate transfer operations with processing operations in the vertical space, enabling parallel execution and improving throughput without increasing horizontal footprint.
Solution Approach 2:
The processing cup is positioned in advance at the lower position corresponding to the second substrate holder before the substrate is transferred there. This preliminary positioning allows the processing liquid to be ready when the substrate arrives, eliminating waiting time and enabling continuous processing.
Solution Approach 3:
The patent ensures continuous useful action by overlapping the substrate lowering operation with the cup lifting operation. While the substrate is being transferred from the first holder to the second holder, the processing cup is simultaneously lifted to its processing position, eliminating idle time and maintaining continuous productive operation.
2Productivity
If multiple holders at different heights are used with coordinated overlapping operations, then throughput is improved, but device complexity increases
Solution Approach 1:
The processing cup serves multiple functions: it holds the processing liquid, positions itself at different height levels, and interfaces with both substrate holders. This multi-functionality reduces the need for separate components for each operation, thereby managing complexity while enabling parallel processing.
Solution Approach 2:
The patent merges the substrate transfer function and the processing liquid delivery function into a coordinated system where the moving substrate holder and the moving processing cup work together. This integration allows the transfer and processing preparation to occur simultaneously, improving throughput without proportionally increasing component count.
Data Source
AI summary
A substrate is held by an upper holding device, and a lower-surface center region of the substrate is cleaned with use of a lower-surface brush. The substrate is lowered from an upper holding device and transferred to a suction holder of a lower holding device. The substrate held by the suction holder is cleaned with use of a processing liquid. A cup is provided to be liftable and lowerable between an upper cup position and a lower cup position. The cup is in the lower cup position when waiting. A period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other.