Rotating Wafer Cleaning Nozzle for Strong Particle Removal
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Solution Overview
Problem
Existing wafer cleaning methods using carbonated water and nitrogen gas for particle removal can cause non-specific oxidation due to increased frictional static electricity when the searing force of small droplets is enhanced.
Innovation Solution
A wafer cleaning apparatus with a rotating plate and a cleaning unit that includes a nozzle with an X-shaped spraying port, utilizing separate supply pipes for distilled water and carbon dioxide gas, and a discharge member that rotates to improve particle removal force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the flow rate of nitrogen gas is increased to enhance particle removal force, then the removal force of particles is improved, but non-specific oxidation occurs due to frictional static electricity
Solution Approach 1:
The cleaning unit is divided into multiple nozzles (first nozzle and second nozzle) that are spatially separated and oriented at different angles. The first nozzle sprays cleaning water from a first direction while the second nozzle sprays from a second direction, creating segmented cleaning zones that reduce static electricity accumulation while maintaining effective particle removal through multi-directional cleaning action
Solution Approach 2:
Different regions of the wafer receive cleaning water at different angles and with different spray characteristics. The first nozzle targets specific areas with a first spray angle while the second nozzle covers other areas with a second spray angle, creating localized cleaning zones that optimize particle removal while controlling static electricity effects in different regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances particle removal efficiency by maintaining a separated state of nitrogen and carbon dioxide gases, improving cleaning power through rotational spraying, thereby reducing oxidation risks.
Implementation Method 1
a non-contact cleaning method that does not re-contaminate particles removed during the CMP process by using carbonated water mixed with carbon dioxide in distilled water
Implementation Method 2
a discharge member at a lower end portion of the nozzle and configured to discharge the cleaning water, which includes the cleaning substance, wherein the discharge member has a spraying port configured to spray the cleaning water therethrough while being rotated
Data Source
AI summary
A wafer cleaning apparatus including a rotating plate configured to support a wafer thereon, and a cleaning unit above the rotating plate and configured to spray cleaning water, wherein the cleaning unit includes a body, a nozzle in the body, at least one supply pipe connected to the nozzle and configured to supply a cleaning substance, and a discharge member at a lower end portion of the nozzle and configured to discharge the cleaning water, which includes the cleaning substance, wherein the discharge member has a spraying port configured spray the cleaning water therethrough, and wherein the spraying port has an X shape may be provided.