Integrated Wafer Cleaning Transfer to Cut Wet-Dry Wait Time
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Solution Overview
Problem
The existing cleaning processes for semiconductor contact structures face challenges in accurately controlling etching time, leading to defects, and the long waiting time between dry and wet cleaning processes compromises the stability of the semiconductor structure during defect filling.
Innovation Solution
A cleaning machine and method that integrate a wet cleaning module, a dry cleaning module, a conveying module, and a transferring module to quickly switch between processes, reducing waiting time and ensuring stability by automatically transferring wafers between the modules based on the required cleaning sequence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different cleaning processes (dry cleaning and wet cleaning) are configured cooperatively to fill etching defects, then the etching defects can be filled, but the waiting time for switching between cleaning processes is long, which compromises the stability of the semiconductor structure
Solution Approach 1:
The patent combines the dry cleaning module and wet cleaning module into a single integrated cleaning machine, allowing seamless transition between cleaning processes without external intervention. The transferring module enables automatic wafer transfer between modules, eliminating the long waiting time associated with switching between separate cleaning processes and maintaining semiconductor structure stability.
Solution Approach 2:
The integrated cleaning machine performs preliminary preparation by having both dry cleaning and wet cleaning modules ready simultaneously. The system can immediately switch between processes without external setup time, as all necessary components and environments are pre-configured within the same machine.
2Loss of time
If multiple cleaning processes are integrated in one machine, then the waiting time is reduced and stability is improved, but the device complexity increases
Solution Approach 1:
The cleaning machine is divided into distinct functional modules: a dry cleaning module for dry cleaning operations, a wet cleaning module for wet cleaning operations, and a transferring module for wafer transfer. This segmentation allows each module to be optimized independently while working together as an integrated system, reducing overall complexity through modular design.
Solution Approach 2:
The transferring module serves multiple functions: it transfers wafers from the dry cleaning module to the wet cleaning module, and vice versa. This multi-functional component reduces the need for separate transfer mechanisms, simplifying the overall device structure while maintaining the ability to perform multiple cleaning sequences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated cleaning machine reduces waiting time between dry and wet cleaning processes, enhancing the stability of semiconductor structures by efficiently completing both cleaning processes in a single machine, thereby improving the quality of defect filling.
Implementation Method 1
a processing module, configured to extract gas from the transferring module
Data Source
AI summary
Disclosed in the present disclosure are a cleaning machine and a cleaning method. The cleaning machine includes: a wet cleaning module, configured to execute a wet cleaning process on a wafer; a dry cleaning module, configured to execute a dry cleaning process on the wafer; a conveying module, configured to input the wafer into the wet cleaning module or the dry cleaning module, or output the wafer from the wet cleaning module or the dry cleaning module; a transferring module, configured to transfer the wafer from the wet cleaning module to the dry cleaning module or transfer the wafer from the dry cleaning module to the wet cleaning module; and a processing module, configured to extract gas from the transferring module.