Wafer Cleaning Water Supply Device with Return Pipe Branching
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Solution Overview
Problem
In multi-chamber single-wafer cleaning machines, the fluctuation in water flow volume leads to excessive discharge of wafer cleaning water, causing burden on supply and drainage facilities and deteriorating the quality of the cleaning solution due to prolonged retention in pipes.
Innovation Solution
A wafer cleaning water supply device with a return pipe branching point within 10 m from the cleaning machine's nozzle tip, allowing excess water to be returned to a reservoir, reducing the amount of water retained in the supply pipe and minimizing pre-dispensing, and incorporating a mechanism for controlling chemical agent addition and ultrapure water flow to maintain stable concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the return pipe is connected immediately before entering the cleaning machine, then the structure is simple, but the amount of discharged cleaning water becomes large and the burden on supply and drainage facilities increases
Solution Approach 1:
The invention changes the spatial dimension of the return pipe connection by specifying a connection point within 10 meters from the nozzle tip rather than immediately before the cleaning machine. This dimensional constraint resolves the contradiction by finding an optimal distance that balances structural simplicity with water discharge reduction.
2Productivity
If a large volume of wafer cleaning water is continuously supplied to meet maximum flow requirements, then the cleaning machine can operate at full capacity, but excessive water is discharged leading to burden on supply and drainage facilities
Solution Approach 1:
The invention implements a feedback mechanism where the return pipe creates a circulation path that allows the system to respond to actual water usage conditions. The returned water can be reused, creating a closed-loop system that adjusts to varying flow requirements without continuously discharging excess water.
3Duration of action of stationary object
If wafer cleaning water remains in the supply pipe for a short period, then the system can maintain continuous supply, but the cleanness of the cleaning water deteriorates and liquid quality changes
Solution Approach 1:
The invention ensures continuous circulation and reuse of cleaning water through the return pipe system. This continuous movement prevents water from stagnating in the supply pipe, maintaining its cleaning effectiveness and liquid quality over extended periods while ensuring uninterrupted supply.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the amount of excess water discharged during pre-dispensing, maintains stable water quality, and minimizes the burden on supply and drainage facilities by efficiently recycling and reusing wafer cleaning water.
Implementation Method 1
a return pipe that branches from the wafer cleaning water supply pipe and returns excessive wafer cleaning water from the cleaning machine to the reservoir
Implementation Method 2
a wafer cleaning water production unit that dissolve a predetermined amount of a chemical agent in a flow volume of ultrapure water thereby to produce wafer cleaning water having a predetermined concentration of the chemical agent
Data Source
AI summary
Wafer cleaning water supply device (1) has a wafer cleaning water production unit (2) that prepares wafer cleaning water (W1) from ultrapure water (W) supplied from a supply path (5), a reservoir (3) for the prepared wafer cleaning water, and a wafer cleaning water supply pipe (6) that supplies the wafer cleaning water (W1) stored in the reservoir (3) to a cleaning nozzle (4A) of a cleaning machine (4). A return pipe (7) is connected to the wafer cleaning water supply pipe (6) on the cleaning machine (4) side so as to be branched at a distance (t) from the tip of the cleaning nozzle (4A), and the wafer cleaning water (W1) which is excessive in the cleaning machine (4) can be returned to the reservoir (3). Such a wafer cleaning water supply device can reduce excessive wafer cleaning water.