Wafer Coating Module Automated Parameter Adjustment
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Solution Overview
Problem
The existing coating module processes for semiconductor wafers require labor-intensive and time-consuming manual adjustments of parameters to achieve optimal coating film removal and cleaning, particularly at beveled and peripheral portions, due to the lack of automated systems that consider cutting states and cleaning states effectively.
Innovation Solution
A substrate processing apparatus with an imaging module and controller that automatically adjusts parameters by imaging the semiconductor wafer's outer end and rear surfaces, determining cutting height and disturbance levels, and resetting parameters such as the number of revolutions or drying time based on reference data to achieve allowable values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual trial and error adjustment is used to set parameters in the coating module, then the cutting state and cleaning state can be recognized and adjusted, but it requires a lot of time and labor and needs experienced operators
Solution Approach 1:
The patent replaces manual visual inspection and manual parameter adjustment with an automated imaging system and control system. The imaging module captures images of the wafer's beveled portion and peripheral portion, and the control system automatically analyzes these images to determine cutting states and cleaning states, then adjusts parameters without human intervention, eliminating the need for experienced operators and significantly reducing adjustment time
Solution Approach 2:
The system enables self-service by allowing the coating module to automatically adjust its own parameters based on image analysis. The control system uses the imaging results to automatically determine the cutting state and cleaning state, and autonomously adjusts parameters such as coating liquid supply amount, solvent discharge amount, and wafer rotation speed without requiring external manual intervention
2Measurement precision
If manual trial and error adjustment is used to set parameters in the coating module, then the cutting state and cleaning state can be recognized and adjusted, but it is a complicated work requiring experienced operators
Solution Approach 1:
The patent replaces complex manual judgment and adjustment operations with automated image processing and control algorithms. The imaging module captures detailed images of the wafer surfaces, and the control system automatically analyzes these images to determine cutting states and cleaning states, eliminating the need for experienced operators to perform complicated visual inspections and manual adjustments
Solution Approach 2:
The patent introduces an imaging module as an intermediary between the coating module and the operator. Instead of directly observing and manually adjusting parameters, the system uses the imaging module to capture images and the control system to analyze them, providing automated feedback that simplifies the operation and eliminates the need for experienced operators
3Manufacturing precision
If existing parameter adjustment techniques are used, then film thickness can be controlled, but parameters affecting cutting state and cleaning state are not considered
Solution Approach 1:
The patent extends the parameter adjustment capability beyond just film thickness control to include multiple functions: coating film formation, beveled portion cutting, and peripheral portion cleaning. The imaging module captures images of both the beveled portion and peripheral portion, and the control system adjusts parameters to optimize all three functions simultaneously, making the system versatile and adaptable to different processing requirements
Solution Approach 2:
The patent implements a feedback mechanism where the imaging module continuously monitors the cutting state and cleaning state by capturing images of the wafer surfaces. The control system analyzes these images and uses the results to automatically adjust parameters such as coating liquid supply amount, solvent discharge amount, and wafer rotation speed, creating a closed-loop control system that adapts to actual processing conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces labor and time required for parameter adjustment, improves accuracy, and facilitates automated parameter setting without relying on experienced operators, ensuring consistent processing of semiconductor wafers.
Implementation Method 1
a coating liquid is supplied onto a central portion of the wafer which is rotating while being mounted on a spin chuck so that a coating film is formed on the wafer
Implementation Method 2
an imaging module including an imaging part configured to image an outer end surface and a rear surface of the semiconductor wafer
Data Source
AI summary
An apparatus includes: a coating module for applying a coating liquid to each wafer and discharging a removing liquid from a nozzle toward a beveled portion of the wafer under rotation; an imaging module; and a controller for controlling: the imaging module to image outer end and rear surfaces of the wafer; obtaining a height dimension of an outer edge of a coating film with respect to an inner edge of the beveled portion based on the imaging result; determining whether or not the obtained dimension is an allowable value; if the result is negative, resetting the number of revolutions of the wafer based on the obtained dimension and a first reference data; controlling the coating module to again perform the application and removal operations; performing the determination process; and if the result is positive, storing the reset number of revolutions in a storage part.