Wafer Collection Timing in Multi-Chamber Processing
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Solution Overview
Problem
The existing multi-chamber substrate processing systems face inefficiencies in throughput due to the long time required to collect processed wafers into FOUPs, leading to idle periods in process modules and reduced productivity, as unprocessed wafers are contaminated by residual corrosive gases if not properly timed.
Innovation Solution
A method and apparatus where processed wafers are collected from a temporary storage chamber into containers based on the timing of the last unprocessed wafer being processed, ensuring unprocessed wafers are not mixed with processed ones and optimizing the collection sequence to reduce idle time and contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If processed wafers are collected into FOUPs in parallel across multiple load ports, then contamination prevention is achieved, but the collection time increases and throughput decreases
Solution Approach 1:
The collection process is segmented into sequential phases: first collecting all processed wafers into one designated FOUP (primary collection target), then subsequently collecting into other FOUPs. This segmentation allows the system to prevent contamination by completing one collection operation at a time, while still achieving overall throughput improvement by avoiding the need to wait for all parallel collections to complete before proceeding with next steps.
Solution Approach 2:
The system performs preliminary action by designating one FOUP as the primary collection target before starting the collection process. This predetermined assignment allows the transfer device to efficiently route processed wafers without real-time decision-making delays, and enables the system to start collection immediately after processing completes, reducing idle time while maintaining contamination prevention through sequential rather than parallel collection.
2Productivity
If processed wafers are collected sequentially into one FOUP at a time, then collection time is reduced and throughput improves, but the complexity of controlling the transfer device increases
Solution Approach 1:
The transfer device autonomously determines the collection sequence and FOUP assignment based on pre-stored mapping information between process modules and FOUPs. The system does not require external real-time intervention to decide which wafer goes to which FOUP; instead, the control device automatically manages the sequential collection process by referencing the predetermined relationships, thereby reducing operational complexity while maintaining high throughput.
Solution Approach 2:
The system changes the operational parameter from parallel multi-FOUP collection to sequential single-FOUP collection. By altering the collection mode from simultaneous operations across multiple load ports to a structured sequential approach, the system simplifies the control logic while improving throughput. The control device manages this by changing the state of the transfer device between different collection phases rather than managing complex parallel operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves throughput and productivity by allowing earlier processing of new wafers and minimizing contamination, thereby reducing the idle time of process modules and enhancing overall efficiency.
Implementation Method 1
a transfer device configured to transfer the object
Implementation Method 2
a temporary storage chamber to temporarily store the object thereinside
Data Source
AI summary
A method of processing an object to by using a processing apparatus is provided. The apparatus includes a plurality of containers to contain the object, a plurality of process chambers to perform a desired process on the object, a temporary storage chamber to temporarily store the object, and a transfer device to transfer the object. The method includes a first step of transferring an unprocessed object from the containers to the process chambers, and a second step of transferring a processed object from the process chambers to the temporary storage chamber. The method further includes a third step of collecting the processed object into one of the containers starting a collection of the processed object from the temporary storage chamber depending on a timing of processing a last object of the one of the containers prior to collecting the processed object into the other containers from the temporary storage chamber.