Wafer Contact Device Using Automated Wire Bonding
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Solution Overview
Problem
Existing contact devices for electrical testing of wafers face challenges such as small contact distances, temperature-related displacement issues, and the need for individually designed devices, which are costly and time-consuming, with manual soldering leading to variability and wiring errors.
Innovation Solution
A contact device with a contact head and printed circuit board featuring longitudinally displaceable, buckling contact elements and automated bonding wires that increase contact distance, allowing for standardized production and easy adaptation to different test items, with severable conductors for customizable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If manual soldering wiring is used to expand contact arrangement, then contact distance is increased to allow test device connection, but production complexity increases and quality consistency deteriorates
Solution Approach 1:
The patent replaces manual mechanical soldering operations with automated wire bonding technology. The wire bonding process uses automated equipment to create electrical connections between contact elements and circuit board pads, eliminating the need for manual soldering while achieving the same electrical connectivity function. This substitution resolves the contradiction by maintaining contact distance expansion capability while dramatically reducing production complexity and improving quality consistency.
Solution Approach 2:
The patent changes the manufacturing parameters from manual soldering processes to automated wire bonding parameters. This includes changing from manual dexterity-based wire placement to automated precision positioning, from solder-based connections to bonded wire connections. These parameter changes enable standardized production procedures that reduce complexity while maintaining the ability to expand contact distances as needed.
2Adaptability or versatility
If manual soldering wiring is used, then contact device can be customized for individual test specimens, but production time increases and wiring errors occur
Solution Approach 1:
The patent replaces manual soldering with automated wire bonding, which can quickly adapt to different test specimen requirements through programmable control. The automated system can change wiring patterns by loading different coordinate data, maintaining customization capability while dramatically increasing production speed and eliminating human error associated with manual operations.
Solution Approach 2:
The patent implements preliminary programming of wire bonding parameters and coordinates for different test specimen types. This allows the automated system to quickly switch between different customization requirements without manual reconfiguration, maintaining adaptability while ensuring consistent, error-free production at high speeds.
3Manufacturing precision
If manual soldering is performed by trained employees, then wiring quality can be achieved, but employee availability decreases and cost increases
Solution Approach 1:
The patent replaces the need for trained manual soldering employees with automated wire bonding equipment. This substitution eliminates dependency on skilled labor availability while maintaining or improving wiring quality through consistent automated execution. The system requires minimal trained operators, primarily for programming and monitoring, rather than for the actual wiring execution.
Solution Approach 2:
The automated wire bonding system performs the wiring operation autonomously based on pre-programmed parameters, eliminating the need for continuous human intervention. The system self-regulates wire placement, bonding parameters, and quality control, thereby removing the bottleneck of employee availability while ensuring consistent manufacturing precision.
4Quantity of substance
If wiring density is increased to accommodate more contacts, then test capability is improved, but manual wiring becomes more difficult and error-prone
Solution Approach 1:
The patent replaces manual high-density wiring with automated wire bonding, which can precisely place bonds in high-density configurations without the confusion and errors associated with manual work. The automated system uses computer-controlled positioning to achieve high wiring density while maintaining ease of operation through programmable sequences.
Solution Approach 2:
The patent uses digital copying of wiring patterns and coordinates to guide the automated wire bonding process. Instead of relying on manual interpretation of complex high-density layouts, the system copies precise digital specifications directly to the bonding equipment, eliminating human confusion while achieving high wiring density with minimal operational difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures high-quality, defect-free contact devices with reduced production time, avoiding manual errors and enabling efficient testing across a wide temperature range, while accommodating electrical components and varying test specimen requirements.
Implementation Method 1
at least some of the second contact surfaces are electrically connected to at least some of the third contact surfaces by means of bonded bonding wires
Implementation Method 2
longitudinally displaceable contact elements, which buckle laterally and flexibly due to the touch contact of the test specimen
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The invention relates to a contact device (1) for an electric contact for electrically testing an electric test object, in particular a wafer, comprising a contact head (2) and at least one printed circuit board (10). The contact head (2) has a plurality of guide bores (3) in which elongated contact elements (4) that buckle elastically in a lateral direction upon contacting the test object are mounted in a longitudinally movable manner. One end (6) of the contact elements is used to contact the test object and the other end (7) is in contact with first contact surfaces (8) which are arranged in a specified pattern (13) and which are located on a face (9) of the printed circuit board (10) in a first region (16), in particular a central region, of the printed circuit board face. Second contact surfaces (12) which are arranged in another specified pattern (14) in particular and which are electrically connected to the first contact surfaces (8) through the printed circuit board (10) lie on the other face (11) of the printed circuit board (10) in a second region (17), in particular a central region, of the printed circuit board face. Third contact surfaces (18) lie on the other face (11) of the printed circuit board (10) in at least one first portion (19), in particular a peripheral portion, of the printed circuit board face. At least some of the second contact surfaces (12) are electrically connected to at least some of the third contact surfaces (18) by means of bonded bonding wires (20). At least some of the first contact surfaces (8) and/or at least some of the second contact surfaces (12) are each electrically connected together by means of severable conductors (39), and at least one of said conductors (39) is severed.