Wafer Contactor Assembly With Angled Contact Rows
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Solution Overview
Problem
Full-wafer testing poses challenges due to the large number of contacts on semiconductor wafers, requiring efficient power, ground, and signal connections, which are difficult to manage effectively in existing testing methods.
Innovation Solution
A contactor assembly with a support structure, terminals, and conductors, featuring angled rows of contacts and threaded openings for secure connector attachment, along with a movable actuator and travel sensor for precise contact and signal transmission, facilitates efficient testing of integrated circuits on wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If full-wafer testing is implemented to test all dies on a wafer, then testing coverage and productivity are improved, but the complexity of managing power, ground, and signal connections increases significantly
Solution Approach 1:
The contactor support structure divides the wafer contact interface into multiple discrete interfaces, each with its own row of contacts. This segmentation allows independent management of power, ground, and signal connections for different regions of the wafer, reducing the overall connection management complexity while maintaining full-wafer testing capability.
Solution Approach 2:
The patent introduces angled rows of contacts that are not aligned with the wafer's standard grid pattern. By rotating the contact rows to angles between 0 and 180 degrees relative to each other, the design creates a dimensional transformation that allows efficient routing of conductors and simplifies connection management while maintaining comprehensive testing coverage.
2Productivity
If a large number of contacts are used on the wafer to maintain high testing coverage, then productivity is improved, but the difficulty of making power, ground, and signal connections increases
Solution Approach 1:
The contactor support structure segments the large number of wafer contacts into multiple organized interfaces with systematic row arrangements. This segmentation creates predictable patterns that simplify the process of making connections, as each interface can be independently accessed and connected using standardized procedures.
Solution Approach 2:
The contactor support structure is designed with movable components that can dynamically adjust the contact positions and angles. This dynamic capability allows the system to adapt to different wafer configurations and connection requirements, making the connection process easier despite the large number of contacts.
3Ease of operation
If multiple rows of contacts are arranged at specific angles to optimize connection efficiency, then ease of operation is improved, but the structural complexity of the contactor assembly increases
Solution Approach 1:
The contactor support structure is designed as a universal platform that can accommodate multiple rows of contacts at various angles (0 to 180 degrees). This multi-functional design allows a single structural framework to support different contact configurations for power, ground, and signal connections, reducing the need for separate specialized components for each function.
Solution Approach 2:
The patent employs a nested arrangement where multiple rows of contacts are integrated within a single contactor support structure. The interfaces are arranged concentrically or in nested patterns, allowing compact integration of multiple contact functions within a unified structural envelope, thereby reducing overall assembly complexity.
Data Source
AI summary
The invention provides an apparatus for testing an integrated circuits on devices including a plurality of electrical subassemblies including a plurality of pattern generator, driver, and power boards divided into physical zones with each physical zone including one pattern generator board, at least one driver board, and at least one power board connected to one another; and a configuration file having information representing flow of current through the electrical subassemblies connected to one another in an interconnection scheme, wherein the electrical subassemblies are organized into at least one logical zone, and wherein the logical zone comprises a plurality of pattern generators.