Wafer Transport Container Air Drying for Oxidation Control
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Solution Overview
Problem
Semiconductor wafers are exposed to undesired particulates like moisture and oxygen during transfer, leading to contamination and oxidation risks, which affect the yield and require additional remedial operations.
Innovation Solution
An air processing system is installed on semiconductor containers, comprising modules for air extraction, contaminant removal, and humidity control, using desiccant materials and filters to maintain low humidity and clean conditions during storage and transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafers are transferred through ambient air during manufacturing processes, then transportation and processing can proceed efficiently, but wafers are exposed to particulates like moisture and oxygen causing contamination and oxidation
Solution Approach 1:
The patent implements a controlled atmosphere system within the semiconductor container that maintains inert or reduced oxygen environment during wafer transport. This prevents oxidation and contamination by excluding harmful ambient air components while allowing efficient wafer movement between processing tools throughout the manufacturing workflow.
2Ease of operation
If wafers are stored in ambient conditions during transport, then handling is simplified, but oxidation and contamination occur affecting yield
Solution Approach 1:
The controlled atmosphere system is integrated into the semiconductor container itself, providing continuous protection during storage and transport operations. This maintains wafer integrity and prevents oxidation while the container is being moved between tools or stored, ensuring high yield without complicating handling procedures.
3Manufacturing precision
If additional remedial operations are performed to address contamination, then wafer quality can be maintained, but processing time and complexity increase
Solution Approach 1:
The controlled atmosphere system performs preventive protection by maintaining a clean, inert environment throughout the entire wafer lifecycle in the container. This eliminates the need for subsequent remedial operations to address contamination, as the preventive measure stops oxidation and particulate contamination before they can occur, thereby maintaining wafer quality without adding processing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces humidity and contaminants within the container, preventing oxidation and improving wafer yield by maintaining a controlled environment during processing, transport, and storage.
Implementation Method 1
Humidity of the air is reduced when the air passes through the desiccant of the air processing system
Implementation Method 2
The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve
Implementation Method 3
An air processing system is installed on semiconductor containers, comprising modules for air extraction, contaminant removal, and humidity control, using desiccant materials and filters
Data Source
AI summary
A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.