3D-Printed Wafer Process Container With Chemical-Resistant Coating
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Solution Overview
Problem
Conventional process containers for semiconductor workpieces have limitations in shape and functional features, chemical resistance, and surface quality, which affect the processing and handling of semiconductor wafers, particularly due to rough surfaces that lead to contamination and inefficient chemical usage.
Innovation Solution
The production of process containers using additive construction processes like 3D printing, combined with low-temperature coating and integrated mechanical elements, allows for optimized shapes, enhanced chemical resistance, and improved fluid dynamics, enabling precise control over chemical supply and removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional manufacturing processes (deep-drawing or welding) are used to produce process containers, then the manufacturing process is well-established and relatively simple, but the shape and functional features of the containers can only be realized to a limited extent
Solution Approach 1:
The patent applies additive manufacturing (3D printing) technology to fundamentally change the manufacturing process parameters, enabling complex shapes and integrated functional features that cannot be achieved with conventional deep-drawing or welding processes. This allows customization of container geometry, wall thickness distribution, and integration of mechanical elements without proportionally increasing manufacturing complexity
Solution Approach 2:
The patent combines additive manufacturing with chemical vapor deposition (CVD) coating to create a composite structure. The base material provides mechanical strength and complex geometry, while the deposited coating layer provides chemical resistance and surface quality, achieving properties that neither material alone could provide
2Manufacturing precision
If conventional manufacturing processes are used, then the manufacturing process is established, but the surface quality is insufficient leading to contamination accumulation
Solution Approach 1:
The additive manufacturing process parameters are optimized to produce surfaces with reduced roughness compared to conventional methods. Additionally, the subsequent CVD coating process further modifies the surface parameters, creating a smooth, chemically resistant surface that prevents contamination accumulation
Solution Approach 2:
The combination of additive-manufactured base material and CVD-deposited coating creates a composite surface structure. The coating layer provides superior surface quality and chemical resistance, eliminating the contamination issues associated with conventional manufacturing surfaces
3Manufacturing precision
If high-temperature coating processes are used on additive-manufactured containers, then high-purity coatings can be applied, but the container deforms due to thermal loads
Solution Approach 1:
The patent changes the temperature parameter of the coating process from conventional high-temperature methods to low-temperature CVD coating. This allows the application of high-purity PTFE coatings at temperatures that do not exceed the thermal stability limits of additive-manufactured materials, preventing deformation while achieving the desired coating quality
Solution Approach 2:
The patent replaces conventional high-temperature thermal coating methods with low-temperature chemical vapor deposition. This substitution of the coating mechanism enables achieving high-purity coatings without subjecting the additive-manufactured container to damaging thermal loads
4Ease of manufacture
If conventional containers with rough surfaces are used, then manufacturing is simpler, but chemical resistance and dirt resistance are reduced
Solution Approach 1:
The patent creates a composite structure combining additive-manufactured base material with CVD-deposited coating. This combination maintains the manufacturing efficiency of additive manufacturing while adding a layer that provides superior chemical resistance and dirt resistance, eliminating the trade-off between manufacturing simplicity and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in containers that are chemically and dirt-resistant, with reduced surface roughness, optimized fluid flow, and minimized chemical consumption, enhancing the processing and handling of semiconductor wafers while reducing contamination and operational costs.
Implementation Method 1
A coating material for protection against chemicals is then applied at least in predetermined areas of a surface of the container
Implementation Method 2
a low-temperature coating process was specifically developed in combination with the additive construction process within the scope of the invention
Data Source
Figure 1~1(e)
Figure 2
AI summary
The invention relates to a method for manufacturing a process container (110) comprising a container for semiconductor workpieces (200), in which the container with a predetermined shape is produced from a base material by means of an additive manufacturing process, wherein a coating material for protection against chemicals is subsequently applied at least in predetermined areas of a surface of the container, and to such a process container (110).