Wafer Transport Container Hinge and Seal for Clean Handling

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Solution Overview

Problem

In semiconductor fabrication, there is a need for containers that maintain a clean room climate to store and transport semiconductor wafers without contaminating substances, as larger wafers with smaller devices require advanced materials and containers to prevent contamination and damage.

Innovation Solution

A container apparatus comprising two body portions with a pivotal pin structure and pin holder system, allowing for airtight sealing and secure storage, along with a wireless communication medium like RFID for tracking, and made from materials providing anti-static properties and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional containers are used for storing and transporting semiconductor wafers, then the containers are simple and easy to manufacture, but they cannot maintain a clean room climate and release contaminating substances

Engineering Contradiction:

Improveclean room climate maintenanceVSAvoidcontainer manufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The container is divided into a lid portion and a base portion that can be separately manufactured and then assembled. This segmentation allows each part to be produced using standard manufacturing processes while achieving the overall clean room climate maintenance function when assembled with proper sealing interfaces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The container is constructed from multiple materials including a rigid outer shell for structural integrity and flexible sealing materials (such as gaskets or O-rings) for creating airtight seals. This composite material approach enables the container to maintain clean room climate while remaining manufacturable through conventional processes.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the container is made tightly sealed to prevent contamination, then the clean room climate is maintained, but the container complexity increases

Engineering Contradiction:

Improvecontamination preventionVSAvoidcontainer structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing function is extracted as a separate component (gasket or O-ring) distinct from the main container structure. This allows the sealing element to be independently optimized and replaced without affecting the overall container design, maintaining tight sealing while managing complexity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Flexible sealing elements such as gaskets or O-rings are used to create the tight seal between the lid and base portions. These flexible components conform to the mating surfaces and provide reliable sealing without requiring complex rigid sealing structures.

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If larger wafers are used to accommodate smaller devices, then device scaling is achieved, but the risk of contamination and damage increases

Engineering Contradiction:

Improvedevice scalingVSAvoidcontamination and damage risk

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The container design includes features such as cushioning materials, shock-absorbing structures, or carefully designed support surfaces that protect the semiconductor wafers from mechanical damage during handling and transport. This beforehand cushioning prevents damage to the precisely manufactured devices on the larger wafers.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The container maintains an inert or controlled atmosphere inside to prevent contamination of the semiconductor wafers. By sealing the container and potentially filling it with clean or inert gas, the wafers are protected from environmental contaminants during storage and transport, enabling safe handling of larger, more precision-critical devices.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Data Source

PatentUS12085220B2Apparatus for storing and transporting semiconductor elements, and method of making the same

Publication Date: 2024.09.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.