Wafer Container Damping Device Shock Absorption
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Solution Overview
Problem
Existing wafer containers are inadequate in protecting wafers from physical shocks and pollution during transportation and processing in semiconductor manufacturing, leading to potential damage.
Innovation Solution
A wafer container with a shock-absorption function, featuring a pod base, cassette, pod shell, and damping devices that include a housing, damping mechanism, and O-ring to absorb impacts and prevent particle contamination, is designed to reduce shock and protect wafers during transportation and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing wafer containers are used for transportation, then wafers can be moved between semiconductor apparatuses, but wafers are vulnerable to physical shocks and pollution during handling
Solution Approach 1:
The patent applies beforehand cushioning by incorporating damping devices with shock-absorbing materials (such as foam or rubber) that are pre-installed in the wafer container. These cushioning elements are positioned to contact the wafer before shock occurs, absorbing impacts during transportation and handling, thereby protecting the wafer from physical damage while maintaining reliable wafer protection
Solution Approach 2:
The patent implements an inert atmosphere principle by providing a clean environment within the wafer container that protects against pollution. The container design includes features that maintain a controlled atmosphere free from particles and contaminants, ensuring the wafer remains protected from pollution during transportation between semiconductor apparatuses
2Reliability
If damping devices are added to the wafer container, then shock absorption capability is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the damping function into separate, modular damping devices that are independently installed in the container. Each damping device is a discrete component with standardized structure, allowing the shock absorption capability to be improved through addition of these modules without requiring complex integration, thereby managing device complexity through systematic segmentation of the protection function
Solution Approach 2:
The patent employs simple, inexpensive damping materials (such as foam or rubber elements) that can be easily replaced if needed. These damping devices are designed as simple mechanical components rather than complex systems, providing effective shock absorption through basic material properties while keeping the overall device complexity low and maintenance straightforward
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shock-absorption function effectively reduces physical impacts on wafers, minimizing damage and maintaining wafer integrity during handling and processing in semiconductor manufacturing environments.
Implementation Method 1
The damping mechanism includes an elastic element, a support rod, and an O-ring. The elastic element is configured to be compressed in the moving direction D1, and another end of the elastic element abuts the support rod
Implementation Method 2
The damping device includes a housing, a damping mechanism, and an O-ring. The O-ring is configured to seal the housing, preventing particle contamination of the wafers during transportation and processing
Data Source
AI summary
A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.