Wafer Container Door Cushions for Shock Resistance
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Solution Overview
Problem
Current wafer containers, especially those for larger diameter wafers, face challenges in providing adequate physical shock resistance and support during shipping, leading to potential wafer damage due to deflection and uneven sealing issues, which previous attempts to address with external cushioning have not fully resolved.
Innovation Solution
The implementation of removable shipping cushions on the inside surface of the front door of wafer containers, providing additional spaced-apart support for the front edges of wafers, enhances physical shock resistance and support, allowing for reduced cushioning requirements in secondary packaging while maintaining automation functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If wafer containers use traditional single-piece wafer cushions on the door, then the container structure remains simple, but physical shock resistance is insufficient for larger diameter wafers during shipping
Solution Approach 1:
The single-piece wafer cushion is divided into multiple separate cushions (first wafer cushion, second wafer cushion, third wafer cushion) positioned at different locations on the door. Each cushion independently supports specific portions of the wafer, providing distributed shock protection without requiring a complex integrated structure.
Solution Approach 2:
Different cushions are positioned to provide localized support at critical areas where wafers contact the door during shipping. The first cushion supports the wafer at a first location, the second cushion supports at a second location, and the third cushion supports at a third location, ensuring optimal protection at each specific point of contact.
2Reliability
If wafer containers are designed for horizontal wafer support during shipping, then handling is simplified, but wafers remain vulnerable to shock loads exceeding 8G when containers are inverted or subjected to considerable shock
Solution Approach 1:
Multiple wafer cushions are pre-positioned on the door to provide support regardless of the container's orientation during shipping. The distributed cushion arrangement ensures that wafers are protected from shock loads in any position, not just when horizontal, eliminating the need for strict orientation constraints during transport.
3Strength
If external cushioning members are added to the outside of sealed wafer containers, then some shock protection is provided, but wafer damage cannot be fully prevented due to deflection and uneven sealing issues
Solution Approach 1:
The wafer cushions are positioned within the container structure, nested between the wafer and the door. This internal cushioning arrangement provides direct support to the wafers from the inside, preventing deflection and ensuring uniform sealing without the interference of external packaging elements.
Data Source
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AI summary
A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers. The system includes a wafer container enclosure defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots; a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side; a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports; and a first removable wafer cushion attachable to the rear side of the front door adjacent the primary wafer cushion, the first removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves and slots.