Wafer Container Door Recess and Side Wall Restraint
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Solution Overview
Problem
Conventional front opening unified pods (FOUPs) face issues with wafer movement during transportation due to inadequate restraint, leading to increased size and dust accumulation, and require frequent disassembly for cleaning, which causes slackening of the wafer restraint module.
Innovation Solution
The FOUP design features wafer restraint modules disposed on two platforms adjacent to the recess of the inner door surface, allowing full wafer settlement and dust collection at the recess corners, with adjustable recess dimensions and wear-resistant materials to reduce friction and facilitate easy cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer restraint module is disposed on the recess of the inner surface of the door, then the wafer can be restrained during transportation, but the FOUP size cannot be effectively reduced and dust accumulates in the recess
Solution Approach 1:
The wafer restraint module is moved from the recess area to the side wall of the container body, utilizing the lateral dimension for restraint functionality. This dimensional relocation allows the recess to be fully utilized for wafer storage while the restraint module operates independently on the side wall, thereby reducing the overall FOUP size without compromising restraint effectiveness.
Solution Approach 2:
The FOUP structure is segmented into distinct functional zones: the container body with slots for wafer storage, the side wall with integrated restraint modules, and the door with recess for sealing. This segmentation allows each component to perform its specific function optimally, with the restraint module positioned on the side wall to prevent wafer movement toward the door opening while maintaining compact overall dimensions.
2Reliability
If the wafer restraint module is disposed on the recess of the inner surface of the door, then the wafer can be restrained, but frequent disassembly for cleaning causes the module to become slackened
Solution Approach 1:
The wafer restraint module is extracted from the door assembly and relocated to the side wall of the container body. This extraction eliminates the need to disassemble the door or restraint module for cleaning purposes, as the restraint module remains fixed on the side wall while the door and recess can be cleaned independently. This resolves the contradiction by maintaining restraint effectiveness while significantly improving cleaning convenience.
3Reliability
If the recess is used for wafer restraint, then the wafer can be sustained, but dust particles accumulate in the recess requiring frequent cleaning
Solution Approach 1:
The wafer restraint function is extracted from the recess area and relocated to the side wall. This extraction eliminates the source of dust generation (friction between the restraint module and wafers within the recess) while maintaining the recess's primary function for wafer storage and sealing. The restraint module on the side wall no longer generates dust in the recess, thereby eliminating the harmful dust accumulation effect.
Data Source
AI summary
A wafer container includes a container body that having a plurality of slots therein for placing a plurality of wafers; an opening is formed on a sidewall of the container body for importing or exporting the wafers; and a door having an inner surface and an outer surface, in which the inner surface of the door is joined with the opening of the container body for protecting the plurality of wafers therein, the characteristic in that: a recess is disposed in the central portion of the inner surface of the door to divide the inner surface into two platforms, and each restraint module is located on two platforms.