Wafer Transport Container With Elastic Retainer for Thinned Wafers

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Solution Overview

Problem

Conventional transport containers for semiconductor wafers struggle to uniformly hold thinned wafers and those with varying diameters, as they are designed for a specific size and thickness, leading to potential deformation and breakage.

Innovation Solution

A transport container with a housing, thresholds, and a retainer system that includes a lid and elastic wing portions to securely hold wafers of different diameters and thicknesses by applying force towards their centers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a retainer is specialized for a specific semiconductor wafer size (e.g., 450 mm diameter), then the wafer can be held with high dimensional accuracy, but the container cannot uniformly hold thinned wafers or wafers with different diameters

Engineering Contradiction:

Improvedimensional accuracy of wafer holdingVSAvoidability to hold different wafer sizes and thicknesses

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The retainer's wing portions are designed with elastic force that can be adjusted to change the holding parameters. By modifying the elastic force characteristics of the wing portions, the retainer can adapt to different wafer thicknesses and diameters while maintaining proper holding pressure and dimensional accuracy across various wafer specifications

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The retainer structure is designed to perform multiple functions: it can hold wafers of different diameters (including 450 mm and smaller sizes) and different thicknesses (including thinned wafers) using the same basic structure. The elastic wing portions provide universal adaptability through their ability to deform and apply force toward the wafer center regardless of specific wafer dimensions

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If a retainer with fixed structure is used for thick wafers, then the structure is simple and easy to manufacture, but thinned wafers cannot be held properly due to insufficient support

Engineering Contradiction:

Improvesimplicity of retainer structureVSAvoidability to hold thinned wafers without deformation

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The elastic force of the wing portions can be designed with appropriate parameters to provide sufficient holding force for thinned wafers. By adjusting the elastic force characteristics, the retainer maintains reliability for holding thin wafers while keeping the structure relatively simple and easy to manufacture

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The retainer uses elastic wing portions that can dynamically adapt to different wafer thicknesses. The elastic deformation allows the structure to provide appropriate support force for thinned wafers while maintaining structural simplicity, eliminating the need for complex adjustable mechanisms

Inventive Principle:

Principle #15Dynamics

3Device complexity

If force is applied at the edge of the wafer to hold it, then the holding mechanism is simple, but thinned wafers deflect and cannot be held with proper dimensional accuracy

Engineering Contradiction:

Improvesimplicity of holding mechanismVSAvoiddimensional accuracy of thinned wafer holding

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

Instead of applying force only at the edge in a single dimension, the wing portions apply force from multiple directions toward the center of the wafer. This multi-dimensional force application prevents deflection of thinned wafers while maintaining a relatively simple holding mechanism structure

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively maintains thinned and differently sized wafers in a stable position, preventing deformation and breakage during storage and processing.

Implementation Method 1

The retainer includes a fixing portion fixed to the inner surface of the lid, and a left-wing portion and a right-wing portion respectively extending to left and right from the fixing portion and having elastic force. The left-wing portion and the right-wing portion hold the end face of the semiconductor wafer by the elastic force.

Methodology Applied

Scientific EffectElastic force: Elasticity

Data Source

PatentUS20250323076A1Transport container for semiconductor wafer and method of manufacturing semiconductor element

Publication Date: 2025.10.16 MITSUBISHI ELECTRIC CORP

AI summary

A transport container includes a housing having an opening through which the semiconductor wafer can be taken in and out from the Y-direction, a pair of thresholds disposed in the housing and supporting the back surface of the circumferential edge portion of the semiconductor wafer in the −X-direction and the X-direction, a lid capable of opening and closing the opening, and a retainer fixed to the inner surface of the lid and holding the end face of the semiconductor wafer in the Y-direction. The retainer includes a fixing portion fixed to the inner surface of the lid, and a left-wing portion and a right-wing portion respectively extending from the fixing portion to the left and right and having elastic force, and the left-wing portion and the right-wing portion hold the end face of the semiconductor wafer by the elastic force.