Wafer Container Flexible Wall Segments Radial Movement

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Solution Overview

Problem

Existing semiconductor wafer containers fail to effectively prevent radial movement of wafers during transportation, which can lead to damage, especially when stacked with spacer rings, as they often rely on separate cushioning components that are not integrated and apply force unevenly.

Innovation Solution

The semiconductor wafer container incorporates flexible wall segments that move radially inward to create an interference fit, using ramped engagement surfaces and resilient inserts to minimize wafer movement, providing comprehensive side and top protection by engaging the top cover and bottom member to reduce radial shift.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate cushioning components are used to protect wafers, then cushioning is provided, but the components are not integrated and apply force unevenly

Engineering Contradiction:
Improvewafer protectionVSAvoidcomponent integration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the cushioning function directly into the sidewalls of the container by incorporating flexible segments that can deform to contact and protect wafers. This merging of the cushioning function into the structural walls eliminates the need for separate cushioning components while ensuring integrated and uniform force distribution across all wafers during stacking and transportation.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If wafers are stacked vertically in transportation, then space is optimized, but radial movement of wafers occurs during transportation

Engineering Contradiction:
Improvetransportation efficiencyVSAvoidwafer position stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The patent employs flexible segments in the sidewalls that can dynamically deform and adapt to the wafer stack during transportation. These flexible segments move radially inward to contact and stabilize wafers, preventing radial movement while maintaining the vertical stacking configuration. The dynamic flexibility allows the structure to respond to movement forces and maintain wafer stability throughout the transportation process.

Inventive Principle:
Principle #15Dynamics

3Reliability

If the container structure is made rigid to prevent wafer movement, then protection is improved, but the ability to adapt to different wafer configurations is reduced

Engineering Contradiction:
Improvewafer containmentVSAvoidconfiguration flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent utilizes flexible segments within the sidewall structure that can deform and conform to different wafer configurations. These flexible portions allow the container to adapt to various stacking arrangements and wafer positions while still providing effective radial containment and protection. The flexibility enables the structure to maintain reliable wafer containment across different operational scenarios.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly reduces radial movement of wafers, enhancing protection and containment by distributing force evenly across multiple directions, thus minimizing damage during transportation, whether with or without spacer rings.

Implementation Method 1

resilient inserts to minimize wafer movement

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS8556079B2Wafer container with adjustable inside diameter
Publication Date: 2013.10.15 TEXCHEM ADVANCED PRODS
  • US8556079B2 patent drawing
  • US8556079B2 patent drawing
  • US8556079B2 patent drawing

AI summary

Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.