Semiconductor Wafer Container Air Processing for Humidity Control
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Solution Overview
Problem
In semiconductor fabrication, wafers are exposed to undesired particulates like moisture and oxygen during transfer, leading to contamination and oxidation risks that affect yield, as existing automated material handling systems do not adequately maintain low humidity and clean conditions during transport and storage.
Innovation Solution
An air processing system is integrated into semiconductor containers, comprising an exchange module, air extraction module, contaminant removal modules, processing module, controller module, and power module, which maintains low humidity and clean conditions by filtering out contaminants and controlling temperature during storage and transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafers are transferred using existing automated material handling systems, then throughput and output rate are improved, but contamination and oxidation risks increase due to inadequate humidity control and particulate exposure
Solution Approach 1:
The patent implements an inert atmosphere by introducing nitrogen gas into the container interior space to displace air, creating an oxygen-free environment that prevents oxidation of wafers during transfer. The nitrogen gas is supplied through a nitrogen gas source connected to the container, maintaining a protective atmosphere throughout the material handling process.
Solution Approach 2:
The patent employs a sealable container with a door that can be closed and sealed to create an isolated interior space. This flexible sealing mechanism allows the container to maintain a controlled atmosphere independently from the external environment, preventing particulate contamination and humidity exposure while wafers are transferred within the container interior.
2Speed
If wafers are exposed to ambient air during transfer, then material handling speed is maintained, but oxidation and contamination occur affecting yield
Solution Approach 1:
The patent performs preliminary action by pre-flushing the container interior space with nitrogen gas before wafer transfer begins. This preliminary nitrogen atmosphere establishment ensures that wafers are immediately protected from oxidation upon entry, eliminating the need to slow down the transfer process for atmospheric conditioning.
Solution Approach 2:
The patent introduces nitrogen gas as an intermediary substance between the wafers and ambient air. This intermediary inert gas layer physically separates the wafers from oxygen and contaminants in the external environment, allowing rapid transfer while maintaining protection. The nitrogen atmosphere acts as a mediator that enables both speed and reliability.
3Extent of automation
If existing material handling systems are used, then automation is maintained, but humidity control capability is insufficient leading to contamination
Solution Approach 1:
The patent integrates multiple functions into the container system: the container serves as both a transport vehicle and a controlled atmosphere chamber. The nitrogen gas supply system, sealable door, and interior space work together to provide both automated material handling and environmental control (humidity and oxygen exclusion) within a single integrated system.
Solution Approach 2:
The container system is self-sufficient by incorporating its own nitrogen gas supply and sealing mechanisms. The container can independently maintain its controlled atmosphere without requiring external humidity control equipment, making the system self-service capable for both transport and environmental control functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air processing system effectively reduces humidity to below 0.7% and filters out particles and residues, creating a clean and controlled environment that mitigates oxidation risks and improves wafer yield during processing, transport, and storage.
Implementation Method 1
an air extraction module configured to extract air from the semiconductor container
Implementation Method 2
The processing module includes at least an adsorbing element
Data Source
AI summary
A container includes a container body and an air processing system. The container body includes a plurality of walls defining an interior space for receiving wafers. The air processing system is attached to the container body. The air processing system includes an exchange module, an air extraction module, a first contaminant removal module, a processing module, a second contaminant removal module, a controller module and a power module. The exchange module is coupled to one of the walls of the container body. The air extraction module extracts air from the container body. The first contaminant removal module is coupled to the air extraction module and the exchange module. The processing module is coupled to the air extraction module. The second contaminant removal module is coupled to the processing module and the exchange module. The controller module is configured to turn the air extraction module on and off.