Semiconductor Wafer Container Non-Contact Storage
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Solution Overview
Problem
Existing semiconductor wafer containers fail to adequately protect wafers with delicate surfaces, such as those with micro-bumps or TSV terminals, from contamination, scratches, and damage during storage and transport, as they often require direct contact with interlayer papers or container surfaces, and vertically-stacked containers can be inefficient in terms of space and cost.
Innovation Solution
A semiconductor wafer container formed by vertically overlapping two substantially flat and identical outer shells, with an inclined surface on the upper shell and a wafer contact surface on the bottom shell, along with shallow gaps and a hanging portion to prevent contact with the wafer surfaces, and a positioning device using bosses and boss holes for secure engagement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the wafer is stored by direct contact with container surfaces or interlayer papers, then the container structure is simple, but the wafer surface is susceptible to contamination, scratches, and damage
Solution Approach 1:
The patent introduces an intermediary mechanism (the inclined surface and shallow gap portion structure) between the wafer and the container outer shell. This intermediary structure allows the wafer to be held securely without direct contact between the wafer surface and the container, thereby preventing contamination and damage while maintaining a relatively simple overall container design
Solution Approach 2:
The patent transitions from a conventional horizontal wafer storage approach to a vertical storage configuration with the wafer standing on its peripheral edge. This dimensional change allows the wafer surfaces to be kept away from the container surfaces, eliminating direct contact and associated harmful effects while using a straightforward container structure
2Productivity
If vertically-placed containers are used to store multiple wafers, then storage space efficiency improves, but thin wafers may be damaged due to lack of wafer keeping capability
Solution Approach 1:
The patent applies local quality by creating a specific localized structure (the inclined surface combined with the shallow gap portion) at the critical contact region where the wafer peripheral edge meets the container. This localized structural feature provides targeted support and protection for thin wafers, ensuring they are securely held without requiring complex overall container designs or sacrificing storage efficiency
3Adaptability or versatility
If the wafer is stored with circuits formed on both surfaces, then the functional capability is enhanced, but the risk of contamination or scratches during storage or transport increases
Solution Approach 1:
The patent employs vertical orientation to store wafers with circuits on both surfaces, positioning the wafers such that their circuit-bearing surfaces face laterally rather than contacting the container surfaces. This dimensional reorientation allows full utilization of dual-sided circuit functionality while inherently protecting both surfaces from contamination and scratches during storage and transport
Data Source
AI summary
A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.