Wafer Container Overlapping Wall Structure

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Solution Overview

Problem

Existing semiconductor wafer containers lack effective side protection, secure top cover orientation mechanisms, and efficient bottom holding mechanisms, leading to potential damage during transportation and automation challenges.

Innovation Solution

The container features an overlapping double wall structure with segmented inner and outer ribs for enhanced side protection, a bi-directional rotation locking mechanism for secure top cover alignment, and a simplified bottom holding mechanism with a single-piece molded latch for automated handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If nested walls are used to protect wafers from side impacts, then protection from direct forces is improved, but flexibility to absorb and cushion impacts is reduced

Engineering Contradiction:
Improveprotection from direct forcesVSAvoidflexibility to absorb and cushion impacts
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent employs nested walls where an inner wall is positioned inside an outer wall, creating a protective structure that filters and absorbs impact forces. The outer wall captures and dissipates direct impact forces before they reach the inner wall, while the nested configuration allows controlled flexing and movement to cushion blows, resolving the contradiction between strength and flexibility.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If outer wall flexing is increased to absorb impacts, then cushioning ability is improved, but wafer stability is reduced causing shifting and scratching

Engineering Contradiction:
Improvecushioning abilityVSAvoidwafer stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The nested wall structure creates a controlled environment where the outer wall can flex independently to absorb impact energy while the inner wall remains relatively stable to protect the wafers. The gap between the nested walls allows the outer wall to move and cushion impacts without transmitting excessive movement to the inner wall, maintaining wafer stability while providing cushioning.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Manufacturing precision

If top cover rotation prevention is improved, then orientation accuracy is improved, but device complexity increases

Engineering Contradiction:
Improveorientation accuracyVSAvoidrotation prevention mechanism complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent uses asymmetric features on the top cover and base, such as non-circular engagement surfaces or specifically shaped latches, that naturally prevent rotation by only fitting in one orientation. This asymmetric design provides precise orientation control without requiring complex mechanical locking mechanisms, resolving the contradiction between orientation accuracy and device complexity.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentEP2470454B1Wafer container with overlapping wall structure
Publication Date: 2017.05.24 TEXCHEM ADVANCED PRODS
  • EP2470454B1 patent drawingFigure 1
  • EP2470454B1 patent drawingFigure 2~3
  • EP2470454B1 patent drawingFigure 4~6

AI summary

Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.