3D-Printed Wafer Transport Container for Wet Overhead Hoist Handling
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Solution Overview
Problem
Existing semiconductor wafer transport containers face challenges such as lengthy loading and unloading times, increased risk of wafer damage during transport, and limitations in shaping and functional features due to manufacturing processes. Additionally, conventional containers are not suitable for overhead hoist transport systems, especially for wet transport processes.
Innovation Solution
A transport container with a mandated shape generated by 3D printing, featuring a coating material for chemical protection applied via a low-temperature process. The container includes integrated workpiece holders and a device for removing liquid media, optimized for use in overhead hoist transport systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If conventional manufacturing processes (thermoforming, injection molding, casting, welding) are used for transport containers, then the containers can be produced with standard methods, but the shaping freedom and functional features are limited
Solution Approach 1:
The patent changes the manufacturing parameter from conventional high-temperature processes to 3D printing additive manufacturing, enabling complex shapes and integrated functional features that were previously impossible to achieve with thermoforming, injection molding, casting, or welding methods
Solution Approach 2:
The patent combines 3D printed base material with chemically resistant coating materials to create a composite structure that achieves both the desired complex shape and chemical resistance properties, resolving the limitation of single-material conventional manufacturing
2Productivity
If wafer cassettes are loaded and unloaded manually or with automated guided vehicles, then the transport containers can be used with floor-based systems, but the loading and unloading process takes up a lot of time
Solution Approach 1:
The patent segments the transport container into modular components including the container body, integrated workpiece holders, and removable lids, enabling rapid loading and unloading of wafer cassettes without manual handling of individual components
Solution Approach 2:
The patent designs the transport container with universal interfaces and standardized dimensions that allow automated loading and unloading systems to efficiently handle multiple container types, reducing the time required for cassette exchange
3Area of stationary object
If floor-based transport systems with AGVs or hand-pushed carts are used, then the transport containers can be moved on the floor, but dedicated transport pathways are required which occupy additional cleanroom area and create long transport paths
Solution Approach 1:
The patent transitions the transport system from floor-based (2D) to overhead hoist-based (3D vertical transport), eliminating the need for dedicated floor pathways and reducing the transport footprint within the cleanroom while maintaining operational efficiency
4Adaptability or versatility
If conventional containers are used for wet transport, then the containers can be used for standard transport, but they are not suitable for overhead hoist transport systems and lack integrated liquid removal capabilities
Solution Approach 1:
The patent merges multiple functions into the container structure: overhead hoist compatibility through standardized interfaces, wet transport capability through chemically resistant coatings, and integrated liquid removal through built-in drainage systems, creating a multi-functional container that adapts to various transport requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved chemical resistance, reduced surface roughness, and enhanced protection against wafer damage during transport. It enables efficient and safe wet transport of semiconductor wafers, reducing loading/unloading times and minimizing contamination risks.
Implementation Method 1
a coating material configured for protection from chemicals capable of etching the semiconductor wafers
Implementation Method 2
The coating material is applied by of a low-temperature coating process
Data Source
AI summary
A transport container transports semiconductor wafers. The transport container includes: a mandated 3D printed shape, including a device in a base that is suitable for removing liquid media; and at a surface of the transport container, a coating material configured for protection from chemicals capable of etching the wafers. The coating material is applied by of a low-temperature coating process. The coating material consists of polytetrafluoroethylene, perfluoroalkoxy polymer, or polyvinylidene fluoride. The mandated form of the transport container also includes an integrated workpiece holder for the wafers or carriers for the wafers, configured such that that the wafers to be transported are loadable in standing form. The transport container is configured for a designated transport direction of the transport container in an automatic transport system that runs parallel to a front or rear side of the semiconductor wafers.