Semiconductor Wafer Convex Side Surface Detection
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Solution Overview
Problem
Conventional means for detecting crystal orientation on semiconductor wafers create local defects and reduce the strength of the wafer, leading to inefficient material utilization and increased manufacturing costs, especially when the wafer thickness is reduced.
Innovation Solution
A semiconductor wafer design featuring a convex side surface with a local flat surface acting as a detection means, which is disposed perpendicularly to the wafer face and back, allowing for easy detection without creating defects or sharp angles, thus maintaining the wafer's strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional means to be detected (such as an orientation flat or notch) is formed in the semiconductor wafer, then the crystal orientation can be detected, but a local defect is created in the face of the wafer, decreasing the effective area for partitioning rectangular regions
Solution Approach 1:
The detection means (flat surface) is moved from the face of the wafer to the side surface. This dimensional relocation allows the detection function to be performed without occupying any area on the face that would otherwise be used for partitioning rectangular regions, thereby resolving the contradiction between detection capability and effective area.
2Measurement precision
If a conventional means to be detected (such as an orientation flat or notch) is formed in the semiconductor wafer, then the crystal orientation can be detected, but a sharp angle or notch is produced, resulting in a marked decrease in the strength of the wafer
Solution Approach 1:
The detection means is relocated to the side surface of the wafer, forming a flat surface that extends substantially perpendicularly to the face. This positioning avoids creating sharp angles or notches on the face that would compromise wafer strength, while still enabling crystal orientation detection through the flat surface geometry.
3Productivity
If the thickness of the semiconductor wafer is markedly decreased to several tens of micrometers, then the manufacturing cost can be reduced, but the strength of the wafer decreases, making it more susceptible to damage from detection means formation
Solution Approach 1:
By forming the detection means on the side surface rather than the face, the invention enables thinner wafers to be used without compromising strength. The flat surface on the side surface does not create weak points in the already-thinned wafer structure, allowing productivity improvements through reduced thickness while maintaining adequate strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient detection of crystal orientation without reducing the effective area for semiconductor circuit formation, maintaining the wafer's strength and reducing manufacturing costs by avoiding defects and sharp angles.
Implementation Method 1
a means to be detected, which is composed of a local flat surface, is disposed in the side surface
Data Source
AI summary
A semiconductor wafer which is disk-shaped as a whole, and which has a substantially flat face, a back substantially flat in at least a main portion thereof and substantially parallel to the face, and a side surface. The side surface is convex as a whole in a longitudinal sectional view. A means to be detected, which is composed of a local flat surface, is disposed in the side surface.