Wafer Conveyance Abnormality Prediction Using Multi-Sensor ML

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Solution Overview

Problem

Existing conveyance abnormality prediction systems in semiconductor manufacturing have low detection probabilities due to simple threshold-based methods, which fail to accurately identify abnormalities in sensor data from wafer handling machines, leading to potential equipment failures and productivity losses.

Innovation Solution

A conveyance abnormality prediction system utilizing a learned model that estimates abnormality based on historical sensor data from multiple sensors, including vibration, sound, and image data, using machine learning techniques such as neural networks and LSTM to improve detection accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a simple threshold-based method is used to detect conveyance abnormalities, then the system is easy to operate and implement, but the detection probability of abnormalities is low

Engineering Contradiction:
Improveease of operationVSAvoiddetection probability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent replaces the simple threshold-based mechanical detection method with a machine learning-based system that uses neural networks and LSTM to analyze sensor data patterns, thereby improving detection probability while maintaining system operability through automated learning

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the detection parameters from simple threshold values to complex multi-parameter sensor data sets including vibration, sound, and image data, processed through machine learning models to improve abnormality detection accuracy

Inventive Principle:
Principle #35Parameter changes

2Reliability

If multiple sensor data types are analyzed using machine learning, then the detection probability of conveyance abnormalities is improved, but the device complexity increases

Engineering Contradiction:
Improvedetection probabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a multi-functional system where a single machine learning framework processes multiple sensor data types (vibration, sound, image) simultaneously, allowing the system to perform comprehensive abnormality detection without proportionally increasing complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system uses self-service through automated machine learning models that automatically learn from historical sensor data and improve detection capabilities without requiring manual intervention, thereby managing complexity through automation

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS12084288B2Conveyance abnormality prediction system
Publication Date: 2024.09.10 EBARA CORP
  • US12084288B2 patent drawing
  • US12084288B2 patent drawing
  • US12084288B2 patent drawing

AI summary

A conveyance abnormality prediction system includes an estimation unit that has a learned model having machine learned a relationship between a data set including sensor data outputted, at a time of substrate transport in the past, from each of a plurality of sensors provided on a substrate transport unit and a degree of conveyance abnormality at the time of the substrate transport, estimates a degree of conveyance abnormality at a time of new substrate transport by using, as an input, a data set including sensor data outputted from each of the plurality of sensors at the time of the new substrate transport, and outputs the estimated degree of conveyance abnormality.