Wafer Cooling Stand Using Down-Flow for Uniform Temperature Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling mechanisms for semiconductor wafers in air atmosphere processing systems are complex and require simpler structures for efficient cooling in atmospheric transfer chambers.
Innovation Solution
A cooling mechanism featuring support stands with air guide plates and support pins that utilize down-flow to efficiently cool semiconductor wafers, with additional cooling means for the central portion and side cooling units to facilitate rapid temperature reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cooling mechanisms are used in atmospheric transfer chambers, then cooling function is provided, but the structure becomes complicated
Solution Approach 1:
The cooling plate is integrated with the support stand structure, merging the cooling function with the support function into a single unified component. This eliminates the need for separate cooling mechanisms and reduces overall structural complexity while maintaining effective cooling capability.
Solution Approach 2:
The support stand is designed to serve multiple functions: it provides mechanical support for the wafer and simultaneously acts as a cooling plate with embedded cooling pipes. This multi-functional design reduces the number of separate components needed in the system.
2Productivity
If cooling mechanisms are added to atmospheric transfer chambers, then wafer cooling is achieved, but the number of components increases
Solution Approach 1:
The cooling function is merged into the support stand by embedding cooling pipes within the cooling plate that forms part of the support structure. This integration allows cooling to be achieved without adding separate cooling components to the atmospheric transfer chamber.
Solution Approach 2:
The support stand itself provides the cooling function through its integrated cooling plate design, eliminating the need for external cooling systems. The structure serves its own cooling needs through the embedded piping system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling mechanism effectively reduces wafer temperatures, improving processing speed and preventing warpage or deformation by ensuring uniform cooling across the wafer surface and central areas.
Implementation Method 1
a cooling mechanism featuring support stands with air guide plates and support pins that utilize down-flow to efficiently cool semiconductor wafers
Implementation Method 2
there have been proposed a technique for providing a cold plate arranged with cooling pipes
Data Source
AI summary
A cooling mechanism includes a plurality of support stands which is provided in a vertical direction over a plurality of stages in an atmospheric transfer chamber where a down-flow is formed, a plurality of support pins which is provided in each of the support stands and supports a target object in contact with the backside of the target object. The cooling mechanism further includes a plurality of air guide plates which is provided in the support stands and cools the target object supported by the support stand located at a lower stage using the down-flow.