Low-Contact-Angle Wafer Cup for Electrostatic Contamination Control
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Solution Overview
Problem
Wafer cups used in semiconductor manufacturing often experience triboelectrification and peeling electrification due to water or chemical solution droplets adhering and moving on their surfaces, leading to electrical charging and potential contamination issues that affect semiconductor device yield.
Innovation Solution
A wafer cup made from a copolymer comprising a tetrafluoroethylene unit and a fluoro(alkyl vinyl ether unit, with a water contact angle of 80 degrees or less on its inner surface, which suppresses triboelectrification and peeling electrification by reducing surface energy and preventing droplet movement-induced charging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wafer cup is used in semiconductor manufacturing with water or chemical solution treatment, then the wafer treatment function is achieved, but triboelectrification and peeling electrification occur due to droplet adhesion and movement on the surface
Solution Approach 1:
The patent changes the surface energy parameter of the wafer cup by controlling the water contact angle to be 80 degrees or less through specific copolymer composition (tetrafluoroethylene and fluoro(alkyl vinyl ether) units). This parameter change prevents droplet adhesion and movement, thereby eliminating triboelectrification and peeling electrification while maintaining the wafer treatment function.
2Object-affected harmful factors
If the water contact angle is reduced to prevent droplet movement, then electrification is suppressed, but the surface energy and wettability are altered
Solution Approach 1:
The patent uses a composite copolymer material consisting of tetrafluoroethylene units and fluoro(alkyl vinyl ether) units in specific proportions. This composite material structure allows precise control of surface energy and wettability properties, achieving a water contact angle of 80 degrees or less while maintaining material stability and preventing electrification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents triboelectrification and peeling electrification, reducing the risk of electrostatic contamination and improving semiconductor device yield by maintaining a low water contact angle, thus ensuring stable and contamination-free processing.
Implementation Method 1
a water contact angle of at least a part of an inner surface of the wafer cup is 80 degrees or less... which suppresses triboelectrification and peeling electrification by reducing surface energy
Data Source
AI summary
A wafer cup including a copolymer containing a tetrafluoroethylene unit and a fluoro(alkyl vinyl ether) unit. A water contact angle of at least a part of an inner surface of the wafer cup is 80 degrees or less.