Flexible Cup Cleaning Assembly for Wafer Stage Particle Removal

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Solution Overview

Problem

In semiconductor manufacturing, particles and contamination accumulate in unreachable areas of the cup used in wet process apparatuses, leading to reduced yield and cleanliness issues, as conventional cleaning devices are insufficient to reach and remove contaminants from the curved surfaces.

Innovation Solution

A particle removing assembly with a flexible ejecting member, comprising elongated tubes and a detachable front tip, is used to introduce pressurized cleaning material into unreachable areas, combined with an automatic cup-cleaning operation that includes a dispensing nozzle and a drying nozzle, adjusting the cup height and angle to effectively remove contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional cleaning devices are used, then the cleaning process is simple, but contaminants cannot be removed from unreachable areas of the cup

Engineering Contradiction:

Improvecleanliness of cupVSAvoidcleaning device structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The cleaning device is divided into multiple segments including a dispensing nozzle, drying nozzle, and flexible ejecting member with elongated tubes. Each segment targets specific areas of the cup, allowing thorough cleaning of unreachable zones while maintaining manageable device complexity through modular design

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flexible ejecting member with elongated tubes extends into the curved portions of the cup that are inaccessible to conventional linear cleaning devices. This dimensional extension allows the cleaning medium to reach unreachable areas along the curved surfaces, solving the accessibility problem

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If manual cleaning methods are used, then device complexity is low, but productivity and cleaning effectiveness are reduced

Engineering Contradiction:

Improvecleaning efficiencyVSAvoidcleaning system

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The system performs automatic cup cleaning through programmed sequences where the dispensing nozzle applies cleaning material, the flexible ejecting member distributes it to unreachable areas, and the drying nozzle removes moisture. This automated self-service process eliminates manual intervention, significantly improving productivity while the standardized routine keeps operational complexity manageable

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The cleaning process continues systematically through multiple stages: dispensing cleaning material, allowing it to act on contaminants, distributing to unreachable areas, rinsing, and drying. This continuous sequence of actions ensures thorough cleaning without interruption, maximizing productivity

Inventive Principle:

Principle #20Continuity of useful action

3Ease of manufacture

If the cup structure is simple, then manufacturing is easier, but contaminants accumulate in curved portions that are hard to reach

Engineering Contradiction:

Improvecup structureVSAvoidcontaminant accumulation

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The flexible ejecting member acts as an intermediary that bridges the gap between the simple cup structure and the need to clean its curved portions. The elongated tubes of the flexible member can navigate and conform to the curved surfaces, delivering cleaning material to areas that would otherwise be inaccessible, thus solving the contaminant accumulation problem without complicating the cup design

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures thorough removal of contaminants from previously inaccessible areas, improving the cleanliness of semiconductor wafer manufacturing processes, reducing downtime, and requiring less manpower for maintenance, thus enhancing efficiency and cost-effectiveness.

Implementation Method 1

pressurized cleaning material is introduced into unreachable areas

Methodology Applied

Scientific EffectPressurized fluid ejection: Pressure Gradient

Implementation Method 2

flexible ejecting member, comprising elongated tubes and a detachable front tip

Methodology Applied

Scientific EffectFlexible material deformation: Elasticity

Data Source

PatentUS11779967B2Particle removing assembly and method of servicing assembly

Publication Date: 2023.10.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.