Wafer Cushion with Folded Ring for Shock Absorption
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Solution Overview
Problem
Existing cushioning solutions for semiconductor wafers during transportation often cause abrasion due to inadequate radial movement restriction, with rigid spacers potentially harming wafers and foam spacers being susceptible to damage and contamination.
Innovation Solution
A single or dual stage wafer cushion with a folded ring design featuring variable cushioning, made from a non-absorbent material that can flex and absorb shocks, with a 'V' cross-section shape allowing minimal contact with the wafer surface and providing distinct cushioning forces through edge and mid-span hinges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid spacer is used to cushion wafers, then the spacer can provide structural support, but it can cause harm to the wafers and may not provide sufficient grip to prevent movement
Solution Approach 1:
The patent uses a flexible cushioning ring made of elastomeric material instead of rigid spacers. The ring has a flexible body that can deform to accommodate wafer thickness variations while maintaining contact with the wafer periphery, providing both structural support and harm prevention through its compliant nature
Solution Approach 2:
The cushioning ring's flexibility allows it to change its physical parameters (shape, volume) in response to compression forces during transportation. The material properties and geometric configuration are designed to provide optimal cushioning force that prevents wafer movement without exceeding damage thresholds
2Reliability
If a foam spacer is used to cushion wafers, then the foam can absorb shock, but the foam spacers are susceptible to damage and aging and can cause contamination
Solution Approach 1:
The patent employs an elastomeric composite material that combines the shock-absorbing properties of foam with the durability and chemical stability of synthetic rubber or similar materials. This composite structure maintains reliability over time while resisting damage and aging that plagues conventional foam spacers
Solution Approach 2:
The cushioning ring is designed as a durable, reusable component rather than a disposable foam element. Its robust construction allows it to withstand multiple transportation cycles without degradation, eliminating the need for frequent replacement and preventing contamination from deteriorating foam particles
3Reliability
If cushioning elements slide radially on the outer surface of wafers during compression, then the spacers can be crushed to absorb shock, but this can cause damage to the wafers
Solution Approach 1:
The cushioning ring features a curved outer surface that matches the cylindrical geometry of the wafer stack. This curved configuration allows the ring to compress axially while maintaining radial contact with the wafer periphery, absorbing shock without sliding that would cause abrasion to the prime wafer surface
Solution Approach 2:
The ring is designed to contact only the periphery region of the wafers, concentrating the cushioning function at the outer edges where it is most needed. This localized contact prevents radial sliding across the entire wafer surface, protecting the prime surface and any circuitry while still providing effective shock absorption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wafer cushion effectively minimizes wafer damage by restricting radial movement and absorbing shocks, while preventing contamination and deformation, ensuring safe transportation of semiconductor wafers.
Implementation Method 1
made from a non-absorbent material that can flex and absorb shocks
Data Source
AI summary
Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.