Wafer Cutting Apparatus Handling Ring Frames and Simple Wafers
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Solution Overview
Problem
The existing cutting apparatuses require separate setups for completely cutting wafers in a ring-shaped frame and incompletely cutting simple wafers, leading to inefficiencies and increased space requirements due to the need for two distinct machines.
Innovation Solution
A versatile cutting apparatus that includes a cassette table for selectively housing both ring-shaped frame wafers and simple wafers, a withdrawing unit for clamping and supporting, and conveying units for handling and cutting, allowing for both complete and incomplete cutting of wafers using the same machine.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate cutting apparatuses are used for complete cutting and incomplete cutting, then the cutting operations can be performed with dedicated equipment, but the device complexity and space requirements increase
Solution Approach 1:
The cutting apparatus is designed with universal functionality to handle both complete cutting of wafers in ring-shaped frames and incomplete cutting of simple wafers. The withdrawing unit can selectively clamp ring-shaped frames or support simple wafers, and the conveying unit can convey both types of wafers to the cutting unit, enabling one apparatus to perform multiple cutting operations that previously required separate machines
Solution Approach 2:
The withdrawing unit is designed with dynamic adaptability to change its configuration based on the wafer type. The clamping part can selectively clamp ring-shaped frames while the support part can support simple wafers, allowing the apparatus to dynamically adjust its operation mode between complete cutting and incomplete cutting without requiring separate dedicated equipment
2Manufacturing precision
If two separate cutting apparatuses are used for complete cutting and incomplete cutting, then each apparatus can be optimized for its specific function, but the space requirements and operational costs increase
Solution Approach 1:
The cutting apparatus integrates universal functionality to perform both complete cutting and incomplete cutting operations within a single machine footprint. The conveying unit can convey both ring-shaped frames and simple wafers to the cutting unit, and the cutting unit can execute both complete cutting through the wafer and incomplete cutting to form grooves, eliminating the need for separate apparatuses and reducing space requirements
Solution Approach 2:
The apparatus merges the functionality of two separate cutting machines into one integrated system. The withdrawing unit combines clamping capability for ring-shaped frames and support capability for simple wafers, the conveying unit can handle both wafer types, and the cutting unit can perform both complete and incomplete cutting, thereby combining multiple functions into a single apparatus
Data Source
AI summary
A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.