Wafer Cutting with Auxiliary Plate to Reduce Blade Deformation

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Solution Overview

Problem

The processing of piezoelectric workpieces with blades containing abrasive grains often results in reduced accuracy due to blade deformation, especially when cutting soft materials, as the blade's cutting edge protrusion range can lead to thicknesswise deformation and inaccuracies in groove formation.

Innovation Solution

A method involving the use of an auxiliary plate with a higher modulus of elasticity than the workpiece material, placed on the workpiece surface, to stabilize the blade during cutting, reducing deformation and enhancing processing accuracy by sandwiching the blade and preventing excessive vibration or flexing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the cutting edge protrusion range is increased to form deep grooves, then the ability to form deep grooves is improved, but the blade deformation increases

Engineering Contradiction:
Improvecutting edge protrusion rangeVSAvoidblade deformation
Core Design Contradiction:
Length of moving objectVSStability of the object's composition

Solution Approach 1:

A support plate is introduced as an intermediary element between the blade and the workpiece. The support plate has a higher modulus of elasticity than the workpiece material, providing additional support to the blade during cutting. This mediator prevents excessive blade deflection while allowing the cutting edge to protrude sufficiently for deep groove formation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system combines materials with different mechanical properties - the support plate is made of a material with higher modulus of elasticity than both the blade and workpiece. This composite approach allows the support plate to provide rigid support where needed while the blade performs the cutting function.

Inventive Principle:
Principle #40Composite materials

2Length of moving object

If the cutting edge protrusion range is increased relative to blade thickness, then deep groove formation capability is improved, but processing accuracy deteriorates

Engineering Contradiction:
Improvecutting edge protrusion rangeVSAvoidprocessing accuracy
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The support plate acts as a mediator that enables the blade to maintain its positional accuracy and orientation during deep cutting operations. By providing additional support beneath the blade, it prevents the blade from deflecting or twisting, thereby maintaining processing accuracy even with a large cutting edge protrusion range.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the blade cuts into soft material workpieces, then the workpiece processability is improved, but the blade deformation increases significantly

Engineering Contradiction:
Improveworkpiece processabilityVSAvoidblade deformation
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The support plate provides a rigid foundation beneath the blade when cutting soft materials. Since soft materials offer less resistance to blade deflection, the support plate's higher modulus of elasticity becomes crucial in preventing the blade from bending or deforming during the cutting process, thereby maintaining processing accuracy.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves the accuracy of groove formation by minimizing blade deformation, ensuring consistent width and depth of grooves, and preventing skewness, thus enabling precise processing of piezoelectric workpieces.

Implementation Method 1

a disk-shaped blade containing abrasive grains cuts into a workpiece including a piezoelectric material

Methodology Applied
Scientific EffectAbrasion: Abrasion

Implementation Method 2

ultrasonic oscillations may be applied to the blade when the blade rotated is caused to cut into the front surface side of the workpiece

Methodology Applied
Scientific EffectUltrasonic oscillation: Ultrasonic Vibration

Data Source

PatentUS11615979B2Method of processing wafer
Publication Date: 2023.03.28 DISCO CORP
  • US11615979B2 patent drawing
  • US11615979B2 patent drawing
  • US11615979B2 patent drawing

AI summary

A method of processing a workpiece with a disk-shaped blade containing abrasive grains includes the steps of placing an auxiliary plate made of a material having a modulus of elasticity higher than a material of which a front surface side of the workpiece is made, on the front surface side of the workpiece, causing the blade rotated to cut into the front surface side of the workpiece to cut the workpiece as well as the auxiliary plate, and removing the auxiliary plate from the workpiece that has been cut by the blade.