Wafer Cutting Orientation Inversion to Suppress Chip Scattering

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Solution Overview

Problem

In semiconductor manufacturing, cutting chips from a ring-shaped projecting portion on the back surface of a wafer tend to scatter and adhere to the front surface, where semiconductor devices are formed, making it difficult to prevent contamination and ensuring proper processing.

Innovation Solution

The method involves holding the wafer with the ring-shaped projecting portion facing upward and cutting it from the side, allowing chips to fall downward, thereby minimizing scattering on the front surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the wafer is cut with a blade from the front surface side in a state where the front surface faces upward, then the cutting process can be performed, but cutting chips scatter on the front surface and adhere to the semiconductor devices

Engineering Contradiction:

Improvecutting processVSAvoidcutting chip scattering

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent inverts the conventional cutting orientation by positioning the wafer with its back surface facing upward instead of the front surface. This inversion causes cutting chips to fall away from the front surface toward the back surface, preventing chip scattering and contamination of semiconductor devices while maintaining effective cutting

Inventive Principle:

Principle #13The other way round (Inversion)

2Productivity

If the wafer is cut from the front surface side, then cutting can be performed, but cutting chips are generated and scatter on the front surface

Engineering Contradiction:

Improvecutting operationVSAvoidcutting chip contamination

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

By inverting the wafer orientation during cutting (back surface up, front surface down), the patent directs cutting chips away from the valuable front surface toward the back surface, preventing contamination loss while maintaining cutting productivity

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively suppresses the scattering of cutting chips on the front surface of the wafer, preventing contamination of semiconductor devices and ensuring stable processing without the need for additional spacers or complex adjustments.

Implementation Method 1

cutting chips generated during the cutting of the wafer drop downward

Methodology Applied

Scientific EffectGravity: Gravitation

Data Source

PatentUS10964524B2Semiconductor manufacturing method for cutting a wafer

Publication Date: 2021.03.30 MITSUBISHI ELECTRIC CORP

AI summary

A back surface of a wafer is formed with a ring-shaped projecting portion. The wafer is cut with a blade from a side of a front surface of the wafer in a state where the projecting portion of the wafer with a back surface facing upward is supported.