Wafer Cutting Line Orientation for Flat Surfaces
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Solution Overview
Problem
The existing object to be processed cutting methods result in level differences on the cut surface, reducing yield due to deviations in the line to cut with respect to the crystal orientation of the substrate, leading to defective chips.
Innovation Solution
The method involves identifying the crystal orientation of the substrate and setting the line to cut parallel to this orientation, even if it means inclining it with respect to the extending direction of the street region between functional devices, to prevent deviations and smooth the cut surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the line to cut is set to pass through the street region between adjacent functional devices, then the cutting process can separate individual chips, but level differences appear on the cut surface and chip yield is reduced
Solution Approach 1:
The patent changes the orientation parameter of the line to cut, specifically setting it parallel to the crystal orientation of the substrate rather than following the street region direction. This parameter change ensures that the cut follows the crystal structure, preventing level differences while still achieving chip separation
Solution Approach 2:
The patent performs preliminary identification of the crystal orientation before setting the line to cut. By first determining the crystal orientation through identification steps, the system can then appropriately set the cutting line to match this orientation, preventing cut surface defects before they occur
2Ease of operation
If the line to cut deviates from the crystal orientation of the substrate, then the cutting can follow the street region direction, but level differences appear on the cut surface
Solution Approach 1:
The patent changes the orientation parameter of the line to cut from following the street region direction to being parallel to the crystal orientation. This ensures that the cutting process respects the crystal structure, eliminating level differences on the cut surface while still achieving effective chip separation
3Manufacturing precision
If the line to cut is set parallel to the crystal orientation, then level differences are inhibited on the cut surface, but the line may not pass through the street region
Solution Approach 1:
The patent applies local quality by making the line to cut inclined with respect to the street region extending direction. This allows the cut to pass through the street region area (maintaining chip separation) while being oriented parallel to the crystal orientation (ensuring flat cut surface), thus satisfying both requirements locally
Data Source
AI summary
The object to be processed cutting method includes: a crystal orientation identifying step of identifying a crystal orientation of the substrate; a line to cut setting step of setting, for the object to be processed, a line to cut passing through a street region formed between adjacent functional devices, after the crystal orientation identifying step; and a cutting step of cutting the object to be processed along the line to cut, after the line to cut setting step. In the line to cut setting step, in a case where an extending direction of the street region does not match the crystal orientation, the line to cut parallel to the crystal orientation and inclined with respect to the extending direction of the street region, is set for the object to be processed.