Semiconductor Wafer Cutting via Modified Layer Detection
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Solution Overview
Problem
The existing semiconductor wafer cutting process is hindered by the presence of unformed modified layers, which can prevent proper cutting of the wafer, especially when these regions are at the starting point of the cutting process, leading to unintended cutting portions and reduced cutting precision.
Innovation Solution
A semiconductor wafer processing apparatus and method that includes a detector to identify unformed modified regions, a position adjuster to reorient the wafer so that formed modified layers serve as the cutting starting point, and a cutter to ensure precise cutting along the modified layer, thereby avoiding unformed regions and achieving a wider, properly cut area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor wafer is cut starting from a peripheral portion, then the cutting process can be initiated, but unintended cutting may occur when unformed modified regions are present at the starting point
Solution Approach 1:
The detector identifies unformed modified regions before the cutting process begins. The position adjuster then repositions the wafer or cutter to ensure the cutting starting point is located in a region with a properly formed modified layer, preventing cutting errors before they occur
Solution Approach 2:
The system uses detection feedback from the detector to determine the actual starting point position. Based on this feedback, the position adjuster modifies the cutting path or starting position to avoid unformed regions, ensuring precise cutting
2Ease of manufacture
If the modified layer formation is incomplete in certain regions, then laser irradiation may be blocked by foreign matter or equipment fault occurs, but proper cutting cannot be achieved in those regions
Solution Approach 1:
The system performs preliminary detection of the modified layer formation status before cutting. Unformed regions are identified in advance, and the cutting path is adjusted to start from or avoid these problematic regions, ensuring reliable cutting despite formation issues
Solution Approach 2:
The system extracts or excludes unformed modified regions from the cutting path planning. By identifying and separating these problematic areas, the cutting process can proceed reliably in only the properly formed regions
3Device complexity
If the cut starting point is fixed at a peripheral portion, then the cutting process is simple, but the cutting may fail when unformed regions are present at that location
Solution Approach 1:
The cutting starting point is made dynamic rather than fixed. The position adjuster changes the starting position based on detector feedback about unformed regions, allowing the system to adapt to different wafer conditions while maintaining cutting accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the proper cutting of semiconductor wafers in a relatively wide region, preventing unintended cutting and ensuring a flat cutting plane, even when unformed regions are present, thus enhancing the manufacturing efficiency and precision of semiconductor elements.
Implementation Method 1
a laser may be irradiated on the semiconductor wafer to form a modified layer extending along the surface inside the semiconductor wafer
Implementation Method 2
a detector (7030) that detects an unformed modified region on a surface of the semiconductor wafer
Data Source
AI summary
A method of manufacturing a semiconductor element includes formation of a modified layer, detection of a first region, and cutting of a semiconductor wafer. In the formation of the modified layer, a laser is irradiated on the semiconductor wafer to form the modified layer extending along a surface of the semiconductor wafer inside the semiconductor wafer. The surface of the semiconductor wafer includes a peripheral portion having the first region and a second region. The first region is a region in which the modified layer is not located, and the second region is a region in which the modified layer is formed. In the cutting of the semiconductor wafer, the semiconductor wafer is cut at the modified layer starting from the second region.