Wafer Cutting Machine Support Surface Shape Correction

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Solution Overview

Problem

Existing cutting machines face issues with support surface shape correction, leading to wobbling cutting blades and widened kerfs, as existing methods risk damaging the support surface during shape confirmation and correction.

Innovation Solution

A cutting machine with a shape storage section, shape measurement unit, determination section, and end face correction device that contactlessly measures and corrects the support surface shape without using a jig, using laser or ultrasonic methods to determine and correct the shape of the support surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a grinding stone is used to correct the support surface shape, then the shape correction is effective, but the support surface may be damaged during the process

Engineering Contradiction:
Improvesupport surface shape accuracyVSAvoidsupport surface damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by performing non-contact measurement of the support surface shape before correction. The laser displacement sensor measures the actual shape of the support surface, and the system calculates the required correction amount in advance, allowing the grinding stone to apply only the necessary correction without excessive material removal that could damage the surface.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback control by using the laser displacement sensor to continuously monitor the support surface shape during the correction process. The measured data is fed back to the control unit, which adjusts the grinding stone's position and movement in real-time to achieve precise correction while preventing over-grinding and surface damage.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If a jig is brought into contact with the support surface for shape confirmation, then the shape can be determined, but the support surface may be damaged

Engineering Contradiction:
Improvesupport surface shape measurementVSAvoidsupport surface damage
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical measurement system (jig contact method) with an optical measurement system. The laser displacement sensor emits laser beams to measure the support surface shape non-contactually, eliminating mechanical contact and the associated risk of surface damage while maintaining high measurement precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Stability of the object's composition

If the support surface shape is not corrected, then the cutting blade rotates without wobble, but the kerf width increases

Engineering Contradiction:
Improvecutting blade rotation stabilityVSAvoidkerf width control
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The system performs preliminary measurement and calculation of the required support surface correction before actual cutting operations. By pre-correcting the support surface shape based on measured deviations, the cutting blade achieves stable rotation without wobble, thereby maintaining precise kerf width control.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate and damage-free correction of the support surface shape, preventing kerf widening and ensuring precise cutting without damaging the support surface.

Implementation Method 1

an emitter unit that emits a laser beam toward the support surface in the axial direction of the spindle, and an image sensor that receives reflected light of the laser beam reflected on the support surface

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

a correction grinding stone arranged such that the correction grinding stone is able to be brought into contact with the support surface

Methodology Applied
Scientific EffectAbrasion: Abrasion

Data Source

PatentUS11826879B2Cutting machine
Publication Date: 2023.11.28 DISCO CORP
  • US11826879B2 patent drawing
  • US11826879B2 patent drawing
  • US11826879B2 patent drawing

AI summary

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.