Wafer Sheet Cutting Table With Local Adhesion to Prevent Wrinkles
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Solution Overview
Problem
Conventional sheet cutting tables face challenges in cutting adhesive sheets around plate-like objects, such as semiconductor wafers, due to wrinkles caused by displacement and adhesion issues, leading to inaccurate cuts and potential damage to the wafer.
Innovation Solution
A sheet cutting table design featuring an inner table for the wafer and an outer table with a non-adherable surface and detachable adherable members that can be adjusted to stick the unnecessary adhesive sheet, preventing wrinkles by maintaining the adhesive sheet's tension during cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the upper surface of the table is provided with a non-adherable treatment surface to prevent tearing during peeling, then the adhesive sheet can be peeled off easily, but wrinkles occur during cutting due to displacement of the adhesive sheet
Solution Approach 1:
The table surface is divided into two regions: a non-adherable treatment surface area and an adherable member area. The non-adherable area allows easy peeling of the adhesive sheet, while the adherable member area prevents displacement during cutting, thus eliminating wrinkles. This local differentiation of surface properties resolves the contradiction between peeling ease and cutting accuracy.
2Ease of operation
If the non-adherable treatment surface is provided on the whole area of the upper surface, then peeling becomes easier, but the adhesive sheet cannot be cut neatly due to wrinkles caused by displacement
Solution Approach 1:
Instead of applying non-adherable treatment to the entire table surface, the invention applies it only to a specific area while providing an adherable member in another area. This local quality approach allows the adhesive sheet to be held firmly during cutting (preventing wrinkles and ensuring precision) while still allowing easy peeling from the non-adherable area.
3Adaptability or versatility
If the adherable member is made detachable, then the sticking area can be adjusted corresponding to adhesive force, but the device complexity increases
Solution Approach 1:
The adherable member is designed to be detachable and reattachable, allowing dynamic adjustment of the sticking area based on the adhesive force of different adhesive sheets. This dynamic configuration enables the system to adapt to various adhesive forces without requiring a completely different table design, balancing versatility with manageable complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for precise cutting of adhesive sheets without wrinkles, enhancing accuracy and ease of peeling and winding, even as the adherable members can be configured to match varying adhesive forces and wafer shapes.
Implementation Method 1
an adherable member which is capable of sticking the unnecessary adhesive sheet area thereto
Implementation Method 2
the adherable member can be warmed using a thermal conduction unit or a heater
Data Source
AI summary
A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.