Wafer Data Management for Non-Stop Die Pickup
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Solution Overview
Problem
Current die supply devices require operational stoppages for setting up wafer-related data, especially when switching between different types of wafers, leading to inefficiencies in production changeovers and requiring manual intervention for non-stop wafer pallet replenishment.
Innovation Solution
A wafer-related data management method and device that allows offline setup of data for die pickup movement and pusher pin movement using a test-use suction nozzle, test-use pusher pin, and test-use camera, linked to a data management server for automated data sharing across multiple component mounting lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wafer-related data setup is performed using the actual die supply device, then accurate die pickup conditions and push conditions can be established, but the component mounting line must be stopped for each new wafer type, reducing production efficiency
Solution Approach 1:
The patent creates a virtual copy of the die supply device including the suction nozzle, pusher pin, and camera in a virtual space. This virtual model allows wafer-related data setup to be performed offline without stopping the actual production line, while still achieving accurate die pickup and push conditions through virtual simulation and image processing.
Solution Approach 2:
The patent performs wafer-related data setup in advance using the virtual die supply device before actual production begins. By preparing pickup conditions, push conditions, and image processing parameters beforehand, the system eliminates the need to stop the production line for setup when changing wafer types.
2Measurement precision
If manual checking of pickup starting position is performed, then accurate positioning can be achieved, but operator intervention is required and non-stop wafer pallet replenishment becomes impossible
Solution Approach 1:
The patent implements automated image processing using a virtual camera to detect the pickup starting position and other wafer characteristics automatically. The system processes images to identify die positions, dimensions, and patterns without human intervention, enabling the die supply device to self-configure for different wafer types and allowing continuous operation during wafer pallet replenishment.
3Productivity
If push amount and push speed are increased to improve productivity, then more dies can be picked up faster, but the suction nozzle may contact the die too strongly and damage or break it
Solution Approach 1:
The patent uses image processing to detect the actual position, size, and characteristics of each die on the wafer. This information provides feedback that allows the system to dynamically adjust push amount and push speed for each specific die, ensuring optimal pickup conditions that maximize productivity while preventing damage from excessive force.
Solution Approach 2:
The patent dynamically changes push parameters (push amount and push speed) based on detected die characteristics such as size, position, and adhesive strength. By adjusting these parameters according to actual conditions rather than using fixed values, the system achieves both high productivity and die protection.
Data Source
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AI summary
A wafer-related data creation device 47 comprising a setting stand for setting wafer pallets, a test-use suction nozzle 51 for picking up die 31 on dicing sheet 34 of a wafer pallet set on the setting stand, test-use pusher pin 53 for pushing up the adhesive section of die 31 from dicing sheet 34 which is being attempted to be picked up by test-use suction nozzle 51, and test-use camera 54 for capturing an image of die 31 on dicing sheet 34 is used, the wafer pallet for which wafer-related data is to be created is set on the setting stand of wafer-related device creation device 47, an image captured by test-use camera 54 is processed, pusher movement of test-use pusher pin 53 and die pickup movement of test-use pickup nozzle 51 is performed and wafer-related data is created.