Multilayer Adhesive Laminate for Wafer Debonding Without Bump Deformation
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Solution Overview
Problem
Existing semiconductor wafer processing technologies face challenges in easily peeling the wafer from the support after polishing without deformation, particularly due to the stress applied during polishing, and in preventing damage to bump balls from external loads.
Innovation Solution
A laminate structure is developed with a protective adhesive layer and a peeling adhesive layer, where the protective adhesive layer is formed using a hydrosilylation reaction-cured polyorganosiloxane composition, and the peeling adhesive layer includes a peeling agent component that does not react with the protective adhesive layer, allowing easy separation without excessive force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer spin coating method is used, then the manufacturing process is simple, but it is difficult to control the film thickness uniformly across large-area substrates
Solution Approach 1:
The patent divides the single coating process into multiple sequential coating layers (first spin coating layer, second spin coating layer, third spin coating layer). Each layer is formed with controlled thickness and composition, allowing cumulative thickness control and uniformity improvement across large substrate areas while maintaining process simplicity through repeated standard coating cycles.
2Manufacturing precision
If multiple spin coating layers are formed to control film thickness, then film thickness uniformity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent varies parameters between coating layers including solvent composition (first solvent vs. second solvent with different boiling points), coating solution concentration, and coating conditions. These parameter changes enable precise control of each layer's properties and cumulative thickness while maintaining manageable process complexity through systematic parameter variation rather than fundamentally different processes.
3Reliability
If organic solvent is used in spin coating, then film formation is effective, but solvent residue remains in the film after drying
Solution Approach 1:
The patent utilizes phase transition differences between solvents with different boiling points. The first solvent (higher boiling point) and second solvent (lower boiling point) are used in sequence, allowing the second solvent to evaporate more completely in subsequent drying steps, thereby reducing overall solvent residue while maintaining effective film formation through the combined action of both solvents.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate structure effectively prevents deformation of bumps and facilitates easy separation of the semiconductor substrate from the support, maintaining the integrity of the bump structure and reducing the risk of damage during processing.
Implementation Method 1
a first spin coating layer is formed on a large-area substrate by spin coating
Implementation Method 2
solvent residue remains in the film after drying
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
Provided are a laminate including an adhesive layer that can implement easy peeling when a semiconductor substrate and a support substrate are separated after processing of the semiconductor substrate and can suppress deformation of a bump, and the like. A laminate includes a semiconductor substrate with a bump; a support substrate; a protective adhesive layer formed so as to be in contact with the semiconductor substrate with a bump; and a peeling adhesive layer formed between the protective adhesive layer and the support substrate, in which the protective adhesive layer is formed of a protective adhesive composition, and the protective adhesive composition contains a component (A) which is cured by a hydrosilylation reaction and does not contain a peeling agent component (B) which does not cause a curing reaction, and the peeling adhesive layer is formed of a peeling adhesive composition, and the peeling adhesive composition contains a component (A) which is cured by a hydrosilylation reaction and a peeling agent component (B) which does not cause a curing reaction.