Automated Wafer Handling System for Debonding and Cleaning
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Solution Overview
Problem
The manual handling of thin semiconductor wafers during debonding and cleaning processes leads to increased breakage and warping, resulting in reduced production yield and higher costs due to human error and inefficiencies in the handling and processing of wafers with varying thicknesses from 0.2 μm to 3 mm.
Innovation Solution
An automated wafer handling system utilizing robotic arms with blade portions and sensors to transfer and position semiconductor wafers within debonding and cleaning modules, reducing direct contact and minimizing handling errors, and incorporating multiple cleaning modules to streamline the debonding and cleaning processes, including the use of solvents and brushes to remove residual adhesives effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual handling is used for thin semiconductor wafers, then ease of operation is maintained, but wafer breakage and warping increase
Solution Approach 1:
The patent replaces manual mechanical handling with an automated handling system that uses a support structure to hold the wafer during cleaning. The system mechanically transfers the wafer between processing modules without direct human contact, eliminating the trade-off between ease of operation and wafer integrity.
Solution Approach 2:
The patent introduces a film frame as an intermediary support structure between the wafer and the handling system. This frame provides mechanical support to thin wafers during transfer and cleaning operations, preventing breakage and warping while enabling automated processing.
2Reliability
If automated handling is implemented, then wafer breakage decreases, but device complexity increases
Solution Approach 1:
The automated handling system is designed with multi-functional modules that perform multiple operations (transfer, support, cleaning) within integrated units. This reduces overall system complexity by consolidating functions rather than using separate dedicated devices for each operation.
Solution Approach 2:
The patent employs a nested structure where the film frame is positioned within the wafer, and the automated handling system operates within a modular cleanroom environment. This nested arrangement allows compact integration of multiple functions in a space-efficient manner.
3Stability of the object's composition
If film frame support is used for thin wafers, then wafer stability improves, but cleaning process complexity increases
Solution Approach 1:
The patent extracts the cleaning operation from manual processes and integrates it into an automated module that specifically addresses the film frame-supported wafer configuration. The cleaning module is designed to accommodate the frame structure without requiring complex additional mechanisms.
Solution Approach 2:
The cleaning process is tailored to the specific geometry and properties of the film frame-supported wafer assembly. Different cleaning methods (solvent application, brushing) are applied to different areas, with the frame structure itself being utilized as part of the cleaning mechanism rather than treated as an obstacle.
Data Source
AI summary
The present disclosure, in some embodiments, relates to a debonding and cleaning apparatus. The apparatus has a debonding module configured to separate semiconductor substrates from carrier substrates. A first cleaning module is configured to clean surfaces of a first plurality of the semiconductor substrates and a second cleaning module is configured to clean surfaces of a second plurality of the semiconductor substrates. The apparatus also has a first substrate handling module including a first robotic arm in communication with the debonding module and a second substrate handling module including a second robotic arm that is located between the first cleaning module and the second cleaning module. The second substrate handling module is configured to transfer the first plurality of the semiconductor substrates to first cleaning module and to transfer the second plurality of the semiconductor substrates to the second cleaning module.