Wafer Defect Image Resolution via AI Reconstruction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor defect review processes using optical equipment and electron microscopes are inefficient due to low-resolution images requiring extensive manpower and time, leading to decreased performance and increased costs.
Innovation Solution
An image processing system that combines optical and electron microscopy data, utilizing a machine learning-based image processing program to enhance image resolution and automate defect inspection, integrating image generating and discriminating models to convert low-resolution optical images into high-resolution electron microscopy-like images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical equipment is used to capture wafer images, then the imaging speed is fast, but the image resolution is low and requires extensive manual review
Solution Approach 1:
The patent introduces an image processing program as an intermediary between optical imaging and electron microscope imaging. This program processes optical images to generate enhanced-resolution images without requiring actual electron microscope imaging, thus serving as a mediator that bridges the gap between fast optical imaging and high-resolution requirements
Solution Approach 2:
The patent creates a copied or simulated version of electron microscope images by processing optical images through a trained program. Instead of directly capturing high-resolution images with expensive and slow electron microscopes, the system generates copies with enhanced resolution that closely resemble electron microscope images
2Measurement precision
If electron microscopes are used to review defects, then the image resolution is high, but the review process requires plenty of manpower and time
Solution Approach 1:
The system generates copied images with enhanced resolution from optical images, eliminating the need for time-consuming electron microscope imaging and manual review of every image. The copied images provide sufficient resolution for defect detection without the time penalty
Solution Approach 2:
The patent replaces the mechanical process of electron microscope imaging and manual review with an automated image processing program. This substitution eliminates the need for physical electron microscope operation and human reviewers to examine each image, dramatically reducing time and manpower requirements
3Measurement precision
If electron microscopes are used to review defects, then the image resolution is high, but the manpower and cost increase
Solution Approach 1:
The system creates high-resolution copies from optical images, eliminating the need for expensive electron microscope equipment and the manpower required to operate and maintain such equipment. The copying process uses software rather than expensive hardware
Solution Approach 2:
The patent substitutes expensive electron microscope equipment and manual labor with an automated image processing system. This replacement reduces both equipment costs and operational costs while maintaining high image resolution
Data Source
AI summary
An image processing method includes: obtaining a defect image of a wafer, processing the defect image to generate a rebuilt image; and when the rebuilt image comprises at least one object pattern, outputting the rebuilt image. The at least one object pattern corresponds to a part of the wafer. A non-transitory computer readable medium and an image processing system are also disclosed herein.